Assignee profile:

BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.

City:

Enschede

Country:

Netherlands

Published Applications:

7

Last publication date:

2022-02-03

Patent Grants:

7

Last grant date:

2023-12-26

Top Inventors for applications by BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.

These are the the leading inventors for applications assigned to BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.:

Also check out BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.'s (Enschede, Netherlands) applicant profile with 11 patent applications submitted.

AssigneeID:

586806 ⎘