Hubei Dinghui Microelectronics Materials Co., LTD

City:

Wuhan

Country:

China

Published Applications:

Last publication date:

2019-03-14

Patent Grants:

Last grant date:

2021-04-06

Top Inventors for applications by Hubei Dinghui Microelectronics Materials Co., LTD

These are the the leading inventors for applications assigned to Hubei Dinghui Microelectronics Materials Co., LTD:

Wentao Dan 1 Sichuan, China
Wentao Dan 1 Chengdu, China

Recent patent applications by Hubei Dinghui Microelectronics Materials Co., LTD

Hubei Dinghui Microelectronics Materials Co., LTD based in Wuhan, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2019-03-14 ✅ Patent 10,967,481 granted on 2021-04-06

US20190076983A1

Performing operations; transporting

CMP layer based on porous cerium oxide and preparation method thereof

Also check out Hubei Dinghui Microelectronics Materials Co., LTD's (Wuhan, China) applicant profile with 1 patent applications submitted.

AssigneeID:

587093 ⎘