GUANGDONG CHIPPACKING TECHNOLOGY CO., LTD.

City:

Dongguan

Country:

China

Published Applications:

Last publication date:

2021-06-17

Patent Grants:

Last grant date:

2021-08-10

Top Inventors for applications by GUANGDONG CHIPPACKING TECHNOLOGY CO., LTD.

These are the the leading inventors for applications assigned to GUANGDONG CHIPPACKING TECHNOLOGY CO., LTD.:

Yiwei HUANG 1 Shipai Town, Dongguan City, China
Zhengguo Wen 1 Dongguan, China
Xilin RAO 1 Shipai Town, Dongguan City, China
Jianwei Yang 1 Dongguan, China

Zhengguo WEN 1 Shipai Town, Dongguan City, China
Fangbiao Liu 1 Dongguan, China
Jianwei YANG 1 Shipai Town, Dongguan City, China
Yiping SI 1 Shipai Town, Dongguan City, China

Yiwei Huang 1 Dongguan, China
Yiping Si 1 Dongguan, China
Fangbiao LIU 1 Shipai Town, Dongguan City, China
Xilin Rao 1 Dongguan, China

Recent patent applications by GUANGDONG CHIPPACKING TECHNOLOGY CO., LTD.

GUANGDONG CHIPPACKING TECHNOLOGY CO., LTD. based in Dongguan, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2021-06-17 ✅ Patent 11,088,053 granted on 2021-08-10

US20210183749A1

Electricity

Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same

Also check out Guangdong Chippacking Technology Co., Ltd.'s (Dongguan, China) applicant profile with 1 patent applications submitted.

AssigneeID:

592163 ⎘