HUBEI DINGHUI MICROELECTRONICS MATERIALS CO., LTD

City:

Hubei

Country:

China

Published Applications:

Last publication date:

2020-07-09

Patent Grants:

Last grant date:

2021-11-23

Top Inventors for applications by HUBEI DINGHUI MICROELECTRONICS MATERIALS CO., LTD

These are the the leading inventors for applications assigned to HUBEI DINGHUI MICROELECTRONICS MATERIALS CO., LTD:

Shunquan ZHU 1 Wuhan, China
Min LIU 1 Wuhan, China
Liyuan CHE 1 Wuhan, China
Yijie LUO 1 Wuhan, China

Jiping ZHANG 1 Wuhan, China

Recent patent applications by HUBEI DINGHUI MICROELECTRONICS MATERIALS CO., LTD

HUBEI DINGHUI MICROELECTRONICS MATERIALS CO., LTD based in Hubei, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2020-07-09 ✅ Patent 11,179,822 granted on 2021-11-23

US20200215661A1

Performing operations; transporting

Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material

Also check out HUBEI DINGHUI MICROELECTRONICS MATERIALS CO., LTD's (Hubei, China) applicant profile with 1 patent applications submitted.

AssigneeID:

595939 ⎘