Hemicellulose Ltd.

City:

Kanagawa

Country:

Japan

Published Applications:

Last publication date:

2020-08-27

Patent Grants:

Last grant date:

2023-11-07

Top Inventors for applications by Hemicellulose Ltd.

These are the the leading inventors for applications assigned to Hemicellulose Ltd.:

Seiji Morita 2 Tokyo, Japan
Jin Nasukawa 2 Tokyo, Japan
Kenichi Sato 2 Tokyo, Japan
Laksmi Kusumawardhani 2 Tokyo, Japan

Recent patent applications by Hemicellulose Ltd.

Hemicellulose Ltd. based in Kanagawa, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2020-08-27 ✅ Patent 11,807,751 granted on 2023-11-07

US20200270430A1

Chemistry; metallurgy

Resin composition and molding method thereof

#2 | 2020-08-27 ✅ Patent 11,767,382 granted on 2023-09-26

US20200270379A1

Chemistry; metallurgy

Resin composition and molding method thereof

Also check out Hemicellulose Ltd.'s (Kanagawa, Japan) applicant profile with 2 patent applications submitted.

AssigneeID:

604671 ⎘