NIPPON DENKAI, LTD.

City:

Chikusei

Country:

Japan

Published Applications:

Last publication date:

2023-02-09

Patent Grants:

Last grant date:

2024-04-09

Top Inventors for applications by NIPPON DENKAI, LTD.

These are the the leading inventors for applications assigned to NIPPON DENKAI, LTD.:

Yasuhiro Endo 2 Chikusei, Japan
Toshio Kawasaki 2 Chikusei, Japan
Toshio KAWASAKI 2 Chikusei-shi, Ibaraki, Japan
Yasuhiro ENDO 2 Chikusei-shi, Ibaraki, Japan

Tsuyoshi Onuma 1 Chikusei, Japan
Tsuyoshi ONUMA 1 Chikusei-shi, Ibaraki, Japan

Recent patent applications by NIPPON DENKAI, LTD.

NIPPON DENKAI, LTD. based in Chikusei, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-02-09 ✅ Patent 11,952,675 granted on 2024-04-09

US20230043755A1

Chemistry; metallurgy

Surface-treated copper foil and method for manufacturing same

#2 | 2022-04-14 ✅ Patent 12,091,766 granted on 2024-09-17

US20220112618A1

Chemistry; metallurgy

Electrolytic copper foil and method for producing same

Also check out NIPPON DENKAI, LTD.'s (Chikusei, Japan) applicant profile with 2 patent applications submitted.

AssigneeID:

612224 ⎘