KELK Ltd.

City:

Hiratsuka

Country:

Japan

Published Applications:

Last publication date:

2024-03-21

Patent Grants:

Last grant date:

2025-05-06

Top Inventors for applications by KELK Ltd.

These are the the leading inventors for applications assigned to KELK Ltd.:

Atsushi Kobayashi 4 Hiratsuka, Japan
Atsushi Kobayashi 4 Hiratsuka-shi, Japan
Wataru Omuro 3 Hiratsuka, Japan
Wataru Omuro 3 Hiratsuka-shi, Japan

Daisuke Goto 1 Hiratsuka, Japan
Daisuke GOTO 1 Hiratsuka-shi, Japan
Hiroyuki Matsunami 1 Hiratsuka, Japan
Tomonori Murata 1 Yokohama-shi, Japan

Tetsushi Tanaka 1 Fujisawa-shi, Japan
Takenori Takahashi 1 Hachioji-shi, Japan
Tetsushi Tanaka 1 Fujisawa, Japan
Daisuke Goto 1 Naka-gun, Japan

Takashi Motoyama 1 Hachioji, Japan
Takashi Motoyama 1 Hachioji-shi, Japan
Hiroyuki Matsunami 1 Hiratsuka-shi, Japan
Kazuji Sasaki 1 Yokohama-shi, Japan

Kazuji Sasaki 1 Yokohama, Japan
Takenori Takahashi 1 Hachioji, Japan
Tomonori Murata 1 Yokohama, Japan

Recent patent applications by KELK Ltd.

KELK Ltd. based in Hiratsuka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-03-21 ✅ Patent 12,295,265 granted on 2025-05-06

US20240099141A1

Electricity

Thermoelectric module and method for manufacturing thermoelectric module post

#2 | 2022-09-01 ✅ Patent 12,259,162 granted on 2025-03-25

US20220275979A1

Mechanical engineering

Processing liquid temperature control apparatus

#3 | 2022-08-18 ✅ Patent 12,444,626 granted on 2025-10-14

US20220262660A1

Electricity

TEMPERATURE CONTROL DEVICE FOR SEMICONDUCTOR WAFER AND TEMPERATURE CONTROL METHOD FOR SEMICONDUCTOR WAFER

#4 | 2022-08-04 ✅ Patent 12,444,631 granted on 2025-10-14

US20220246459A1

Electricity

SUBSTRATE SUPPORT DEVICE

#5 | 2022-04-14 ✅ Patent 12,183,552 granted on 2024-12-31

US20220115215A1

Electricity

Substrate processing apparatus

#6 | 2021-12-09 ✅ Patent 11,953,491 granted on 2024-04-09

US20210382031A1

Physics

Detection device

Also check out KELK Ltd.'s (Hiratsuka, Japan) applicant profile with 7 patent applications submitted.

AssigneeID:

612292 ⎘