Taoyuan
Taiwan
11
2024-07-11
11
2025-01-07
These are the the leading inventors for applications assigned to LEAP Semiconductor Corp.:
LEAP Semiconductor Corp. based in Taoyuan, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method of manufacturing merged PiN Schottky (MPS) diode
#2 | 2024-05-23 ✅ Patent 12,154,991 granted on 2024-11-26Method of manufacturing wide-band gap semiconductor device
#3 | 2024-04-04 ✅ Patent 12,095,254 granted on 2024-09-17Electronic device and temperature detection device thereof
#4 | 2024-03-28 ✅ Patent 12,442,695 granted on 2025-10-14TEMPERATURE SENSING DEVICE
#5 | 2024-03-28 ✅ Patent 12,341,513 granted on 2025-06-24DRIVING VOLTAGE GENERATING DEVICE
#6 | 2024-01-18 ✅ Patent 12,402,390 granted on 2025-08-26METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR POWER DEVICE
#7 | 2024-01-04 ✅ Patent 12,068,742 granted on 2024-08-20Short-circuit protection circuitry
#8 | 2023-12-21 ✅ Patent 12,376,331 granted on 2025-07-29SEMICONDUCTOR POWER DEVICE AND METHOD OF MANUFACTURING THE SAME
#9 | 2023-10-12 ✅ Patent 12,166,082 granted on 2024-12-10Silicon carbide semiconductor power transistor and method of manufacturing the same
#10 | 2023-10-05 ✅ Patent 11,990,553 granted on 2024-05-21Merged PiN Schottky (MPS) diode and method of manufacturing the same
#11 | 2023-08-17 ✅ Patent 11,955,567 granted on 2024-04-09Wide-band gap semiconductor device and method of manufacturing the same
Also check out LEAP Semiconductor Corp.'s (Taoyuan, Taiwan) applicant profile with 11 patent applications submitted.
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