Assignee profile:

Splink, Inc.

City:

Tokyo

Country:

Japan

Published Applications:

2

Last publication date:

2023-07-20

Patent Grants:

2

Last grant date:

2024-04-30

Top Inventors for applications by Splink, Inc.

These are the the leading inventors for applications assigned to Splink, Inc.:

Also check out Splink, Inc.'s (Tokyo, Japan) applicant profile with 2 patent applications submitted.

AssigneeID:

613917 ⎘