DEE LAB CO., LTD.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2023-05-11

Patent Grants:

Last grant date:

2024-05-07

Top Inventors for applications by DEE LAB CO., LTD.

These are the the leading inventors for applications assigned to DEE LAB CO., LTD.:

Naoki HONDA 1 Osaka-shi, Osaka, Japan
Naoki Honda 1 Osaka, Japan
Takahiro Okugawa 1 Osaka, Japan
Takahiro OKUGAWA 1 Osaka-shi, Osaka, Japan

Recent patent applications by DEE LAB CO., LTD.

DEE LAB CO., LTD. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-05-11 ✅ Patent 11,975,524 granted on 2024-05-07

US20230146715A1

Performing operations; transporting

Cold protection material and method for manufacturing same

Also check out DEE LAB CO., LTD.'s (Osaka, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

614334 ⎘