🔗 Permalink

Assignee profile:

PURPLE CLOUD DEVELOPMENT PTE. LTD.

City:

Singapore

Country:

Singapore

Published Applications:

Last publication date:

2026-05-28

Patent Grants:

Last grant date:

2025-11-11

Top Inventors for applications by PURPLE CLOUD DEVELOPMENT PTE. LTD.

These are the the leading inventors for applications assigned to PURPLE CLOUD DEVELOPMENT PTE. LTD.:

Xue Mei WANG 11 Hui Zhou City, China
Xiao Min ZHANG 7 Hui Zhou City, China
Shiman Xu 5 Hui Zhou City, China
Shi Man XU 4 Hui Zhou City, China

Xiong ZHANG 4 Hui Zhou City, China
Lei-Lei Liu 4 Hui Zhou City, China
Xue Mei WANG 3 Singapore, Singapore
Xue Mei Wang 3 Hui Zhou, China

Shiman Xu 3 Singapore, Singapore
Dachang YIN 3 Hui Zhou City, China
Hsiang-Chieh TSENG 3 Singapore, Singapore
HUA-YUAN LIN 3 Hui Zhou City, China

Xiao Min Zhang 2 Hui Zhou, China
Xiao-Yao LI 2 Hui Zhou City, China
Zhijie YANG 2 Hui Zhou City, China
Yao-Chun WANG 2 Taipei City, Taiwan

YUAN-LONG WEN 2 Hui Zhou City, China
Lei Lei Liu 2 Hui Zhou, China
Xianyao LIU 2 Hui Zhou City, China
Lei Lei LIU 2 Singapore, Singapore

YU-KA FENG 2 Hui Zhou City, China
JIAN-JIA HUANG 2 Taipei City, Taiwan
Xiao-Yao Li 1 Hui Zhou, China
Sy-Chi KUO 1 Singapore, Singapore

Shiman Xu 1 Hui Zhou, China
CONG HE 1 Singapore, Singapore
Hua-Yuan LIN 1 Taipei City, Taiwan
Cheng-Han HSIEH 1 Singapore, Singapore

Hung-Wei CHANG 1 Taipei City, Taiwan
Yuan chin Chen 1 Singapore, Singapore
LIUPING FENG 1 Singapore, Singapore
Xiangwei OU 1 Hui Zhou City, China

Venkata Raman SAHOO 1 Singapore, Singapore
Yu-Ka Feng 1 Hui Zhou, China
Jiasheng LAI 1 Hui Zhou City, China
Hua-Yuan LIN 1 Singapore, Singapore

WENJIAN ZHANG 1 Singapore, Singapore
SHAO-HSUAN KE 1 Taipei City, Taiwan
Zhijie Yang 1 Hui Zhou, China
Bin DENG 1 Hui Zhou City, China

Shi-Man Xu 1 Hui Zhou, China
Weijiang LIU 1 Singapore, Singapore
Yu lun Huang 1 Taipei City, Taiwan
Xiong Zhang 1 Hui Zhou, China

Xianyao Liu 1 Hui Zhou, China
LEILEI LIU 1 HUI ZHOU CITY, China
Yuan-Long Wen 1 Hui Zhou, China
Wei-Pin LIN 1 Singapore, Singapore

Yao-Chun Wang 1 Taipei, Taiwan
Jian-Jia HUANG 1 Singapore, Singapore
Xiong Zhang 1 Singapore, Singapore
YU WEI HAO 1 Hui Zhou City, China

Hua-Yuan Lin 1 Hui Zhou, China
YANGZHOU CAI 1 Singapore, Singapore

Recent patent applications by PURPLE CLOUD DEVELOPMENT PTE. LTD.

PURPLE CLOUD DEVELOPMENT PTE. LTD. based in Singapore, SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-05-28

US20260150229A1

Electricity

HEAT DISSIPATION MODULE AND FAN ASSEMBLY

#2 | 2026-05-28

US20260146629A1

Mechanical engineering

FAN DEVICE

#3 | 2026-05-14

US20260132992A1

Mechanical engineering

THREE-DIMENSIONAL HEAT TRANSFER DEVICE

#4 | 2026-05-14

US20260132801A1

Mechanical engineering

HEAT DISSIPATION DEVICE WITH FAN MODULE

#5 | 2026-05-14

US20260132796A1

Mechanical engineering

FAN MODULE WITH DETACHABLE DUAL-FAN ASSEMBLY

#6 | 2026-04-30

US20260118067A1

Mechanical engineering

VAPOR CHAMBER

#7 | 2026-04-30

US20260117798A1

Mechanical engineering

DETACHABLE FAN ASSEMBLY

#8 | 2026-04-09

US20260101481A1

Electricity

HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREFOR

#9 | 2026-04-02

US20260092745A1

Mechanical engineering

SILVER-COPPER ALLOY WELDING RING USED IN HEAT DISSIPATION DEVICES

#10 | 2026-03-19

US20260078964A1

Mechanical engineering

FIN STRUCTURE

#11 | 2026-03-19

US20260078773A1

Mechanical engineering

LIGHT EMITTING FAN

#12 | 2026-03-19

US20260078764A1

Mechanical engineering

LIGHT EMITTING FAN

#13 | 2026-03-05

US20260063374A1

Mechanical engineering

THREE-DIMENSIONAL HEAT CONDUCTING STRUCTURE AND MANUFACTURING METHOD THEREOF

#14 | 2026-02-26

US20260059700A1

Electricity

LIQUID DISPENSER AND MANUFACTURING METHOD THEREOF

#15 | 2026-02-05

US20260036139A1

Mechanical engineering

FAN ASSEMBLY, FAN APPARATUS, AND CONNECTOR

#16 | 2026-01-15

US20260020191A1

Electricity

HEAT DISSIPATING DEVICE

#17 | 2025-12-25

US20250393168A1

Electricity

HEAT DISSIPATION DEVICE AND A HEAT-CONDUCTING PLATE THEREOF

#18 | 2025-11-20

US20250358952A1

Electricity

FAN AND FAN MODULE WITH MODULAR ASSEMBLY STRUCTURE

#19 | 2025-11-13

US20250351292A1

Electricity

HEAT DISSIPATION DEVICE

#20 | 2025-11-13

US20250347296A1

Mechanical engineering

HEAT DISSIPATION DEVICE

#21 | 2025-11-06

US20250341672A1

Physics

LIGHT EMITTING MULTI FAN DEVICE

#22 | 2025-09-18

US20250290704A1

Mechanical engineering

THREE DIMENSIONAL HEAT DISSIPATION DEVICE, MANUFACTURING METHOD THEREOF, AND SHAPING TOOL

#23 | 2025-09-11

US20250287541A1

Electricity

VAPOR CHAMBER

#24 | 2025-09-11

US20250283668A1

Mechanical engineering

COMMUNICATION-TYPE THERMAL CONDUCTION DEVICE

#25 | 2025-09-04

US20250280513A1

Electricity

HEAT PIPE

#26 | 2025-08-14

US20250257953A1

Mechanical engineering

HIGH HEAT COOLING DEVICE

#27 | 2025-08-07

US20250254829A1

Electricity

VAPOR CHAMBER

#28 | 2025-08-07

US20250251199A1

Mechanical engineering

VAPOR CHAMBER

#29 | 2025-07-03

US20250216158A1

Mechanical engineering

THREE-DIMENSION HEAT TRANSMISSION DEVICE

#30 | 2025-03-13

US20250085062A1

Mechanical engineering

HEAT PIPE ASSEMBLY

#31 | 2025-02-27

US20250067519A1

Mechanical engineering

THREE-DIMENSIONAL HEAT TRANSFER DEVICE

#32 | 2025-02-13

US20250056751A1

Electricity

ELECTRONIC DEVICE AND IMMERSION COOLING SYSTEM

#33 | 2025-02-06

US20250048499A1

Electricity

HEATING ASSEMPLY

#34 | 2024-12-12 ✅ Patent 12,467,468 granted on 2025-11-11

US20240410382A1

Mechanical engineering

Light emitting fan

#35 | 2024-09-26 ✅ Patent 12,467,475 granted on 2025-11-11

US20240318665A1

Mechanical engineering

Light emitting fan

#36 | 2024-09-19 ✅ Patent 12,510,303 granted on 2025-12-30

US20240310126A1

Mechanical engineering

VAPOR CHAMBER

#37 | 2024-07-18

US20240240870A1

Mechanical engineering

HEAT EXCHANGER MOUNTING DEVICE

#38 | 2024-04-18 ✅ Patent 12,460,876 granted on 2025-11-04

US20240125563A1

Mechanical engineering

FIN STRUCTURE

#39 | 2024-04-11 ✅ Patent 12,410,814 granted on 2025-09-09

US20240117815A1

Mechanical engineering

FAN ASSEMBLY, FAN APPARATUS, AND CONNECTOR

#40 | 2024-04-04 ✅ Patent 12,624,901 granted on 2026-05-12

US20240110751A1

Mechanical engineering

Thin Heat Pipe with Sintered Powdered Wick Structure

#41 | 2024-02-29 ✅ Patent 12,507,378 granted on 2025-12-23

US20240074114A1

Electricity

HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREFOR

#42 | 2024-02-08 ✅ Patent 12,446,191 granted on 2025-10-14

US20240049429A1

Electricity

HEAT DISSIPATING DEVICE

#43 | 2023-11-09 ✅ Patent 12,638,246 granted on 2026-05-26

US20230358482A1

Mechanical engineering

THREE-DIMENSIONAL HEAT EXCHANGER

#44 | 2023-07-06 ✅ Patent 12,601,549 granted on 2026-04-14

US20230213288A1

Mechanical engineering

THREE-DIMENSIONAL HEAT TRANSFER DEVICE

Also check out PURPLE CLOUD DEVELOPMENT PTE. LTD.'s (Singapore, Singapore) applicant profile with 55 patent applications submitted.

AssigneeID:

620277 ⎘