Bond Distributing, Ltd.

City:

Eastlake, Ohio

Country:

United States

Published Applications:

Last publication date:

2022-08-04

Patent Grants:

Last grant date:

2024-07-23

Top Inventors for applications by Bond Distributing, Ltd.

These are the the leading inventors for applications assigned to Bond Distributing, Ltd.:

Scott Fishel 1 Concord, OH United States
Connor Fishel 1 Willoughby, OH United States
Paul Smith 1 Mentor, OH United States

Recent patent applications by Bond Distributing, Ltd.

Bond Distributing, Ltd. based in Eastlake, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2022-08-04 ✅ Patent 12,043,756 granted on 2024-07-23

US20220243069A1

Chemistry; metallurgy

Electron beam irradiation process and polymerizable stain applied to wood planking

Also check out Bond Distributing, Ltd.'s (Eastlake, United States) applicant profile with 2 patent applications submitted.

AssigneeID:

620509 ⎘