Tokyo
Japan
31
2014-04-24
31
2016-01-26
These are the the leading inventors for applications assigned to Renesas Eastern Japan Semiconductor, Inc.:
Renesas Eastern Japan Semiconductor, Inc. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Insulated gate type semiconductor device and method for fabricating the same
#2 | 2013-10-10 ✅ Patent 8,816,411 granted on 2014-08-26Mosfet package
#3 | 2013-05-30 ✅ Patent 8,642,401 granted on 2014-02-04Insulated gate type semiconductor device and method for fabricating the same
#4 | 2012-03-08 ✅ Patent 8,292,159 granted on 2012-10-23Fabrication method of semiconductor integrated circuit device
#5 | 2011-06-02 ✅ Patent 8,080,831 granted on 2011-12-20Semiconductor device and manufacturing the same
#6 | 2011-04-21 ✅ Patent 8,035,979 granted on 2011-10-11Printed wiring board with built-in semiconductor element, and process for producing the same
#7 | 2011-03-24 ✅ Patent 8,074,868 granted on 2011-12-13Fabrication method of semiconductor integrated circuit device
#8 | 2010-09-16 ✅ Patent 8,117,742 granted on 2012-02-21Fabrication method of semiconductor integrated circuit device
#9 | 2010-04-22 ✅ Patent 7,741,656 granted on 2010-06-22Semiconductor device and manufacturing the same
#10 | 2009-12-15 ✅ Patent 7,633,147 granted on 2009-12-15Semiconductor unit having two device terminals for every one input/output signal
#11 | 2009-05-21 ✅ Patent 7,894,200 granted on 2011-02-22Printed wiring board with built-in semiconductor element, and process for producing the same
#12 | 2009-04-30 ✅ Patent 7,671,381 granted on 2010-03-02Semiconductor device and manufacturing the same
#13 | 2009-01-01 ✅ Patent 7,681,308 granted on 2010-03-23Fabrication method of semiconductor integrated circuit device
#14 | 2007-12-13 ✅ Patent 7,757,930 granted on 2010-07-20Fabrication method of semiconductor integrated circuit device
#15 | 2007-02-13 ✅ Patent 7,176,569 granted on 2007-02-13Semiconductor device and method of manufacturing the same
#16 | 2006-11-23 ✅ Patent 7,217,987 granted on 2007-05-15Semiconductor device and manufacturing the same
#17 | 2006-10-10 ✅ Patent 7,119,004 granted on 2006-10-10Semiconductor device, its manufacturing method, and ratio communication device
#18 | 2006-05-18 ✅ Patent 7,377,031 granted on 2008-05-27Fabrication method of semiconductor integrated circuit device
#19 | 2006-05-02 ✅ Patent 7,037,760 granted on 2006-05-02Fabrication method of semiconductor integrated circuit device
#20 | 2006-04-18 ✅ Patent 7,029,936 granted on 2006-04-18Semiconductor laser, device having reduced contact resistance and manufacturing method thereof
#21 | 2006-03-28 ✅ Patent 7,019,388 granted on 2006-03-28Semiconductor device
#22 | 2006-02-28 ✅ Patent 7,005,310 granted on 2006-02-28Manufacturing method of solid-state image sensing device
#23 | 2005-12-13 ✅ Patent 6,975,026 granted on 2005-12-13Package for mounting semiconductor device
#24 | 2005-12-08 ✅ Patent 7,345,892 granted on 2008-03-18Semiconductor device, noise reduction method, and shield cover
#25 | 2005-05-24 ✅ Patent 6,897,129 granted on 2005-05-24Fabrication method of semiconductor device and semiconductor device
#26 | 2005-05-19 ✅ Patent 7,265,446 granted on 2007-09-04Mounting structure for semiconductor parts and semiconductor device
#27 | 2005-05-12 ✅ Patent 7,087,977 granted on 2006-08-08Semiconductor device including multiple wiring layers and circuits operating in different frequency bands
#28 | 2005-03-24 ✅ Patent 7,270,258 granted on 2007-09-18Method of fabrication of semiconductor integrated circuit device
#29 | 2005-03-17 ✅ Patent 7,115,482 granted on 2006-10-03Method of manufacturing semiconductor device
#30 | 2005-03-03 ✅ Patent 7,168,161 granted on 2007-01-30Manufacturing method of solid-state image sensing device
#31 | 2005-01-13 ✅ Patent 7,015,071 granted on 2006-03-21Method of manufacturing a semiconductor device
Also check out Renesas Eastern Japan Semiconductor, Inc.'s (Tokyo, Japan) applicant profile with 2 patent applications submitted.
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