Singapore
Singapore
13
2025-12-18
0
-
These are the the leading inventors for applications assigned to SILICON BOX PTE. LTD.:
SILICON BOX PTE. LTD. based in Singapore, SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
SEMICONDUCTOR PACKAGE DEVICE HAVING FAN-OUT STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#2 | 2025-10-02SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
#3 | 2025-10-02SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
#4 | 2025-09-18SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
#5 | 2025-09-18SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
#6 | 2025-07-03CHIP BONDING APPARATUS FOR SEMICONDUCTOR PACKAGING AND SEMICONDUCTOR PACKAGING METHOD USING THE SAME
#7 | 2025-07-03REDISTRIBUTION LAYER STRUCTURE, METHOD OF FORMING REDISTRIBUTION LAYER STRUCTURE, SEMICONDUCTOR PACKAGE DEVICE INCLUDING REDISTRIBUTION LAYER STRUCTURE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE DEVICE INCLUDING REDISTRIBUTION LAYER STRUCTURE
#8 | 2025-03-27INTERCONNECTION MODULE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE DEVICE INCLUDING THE SAME, AND MANUFACTURING METHODS THEREOF
#9 | 2025-02-20METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAGING DEVICE MANUFACTURED THEREBY
#10 | 2025-02-20METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAGING DEVICE MANUFACTURED THEREBY
#11 | 2025-02-13FAN-OUT PACKAGE INCLUDING BRIDGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#12 | 2024-10-31METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAGING DEVICE MANUFACTURED THEREBY
#13 | 2024-10-17METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAGING DEVICE MANUFACTURED THEREBY
Also check out SILICON BOX PTE. LTD.'s (Singapore, Singapore) applicant profile with 13 patent applications submitted.
627357 ⎘