HCP PACKAGING CO., LTD.

City:

Jiangsu

Country:

China

Published Applications:

Last publication date:

2023-08-03

Patent Grants:

Last grant date:

2024-11-12

Top Inventors for applications by HCP PACKAGING CO., LTD.

These are the the leading inventors for applications assigned to HCP PACKAGING CO., LTD.:

Ming Kei Wu 1 Jiangsu, China
Ming Kei Wu 1 Suzhou, Jiangsu, China

Recent patent applications by HCP PACKAGING CO., LTD.

HCP PACKAGING CO., LTD. based in Jiangsu, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-08-03 ✅ Patent 12,138,645 granted on 2024-11-12

US20230241633A1

Performing operations; transporting

Liquid pump

Also check out HCP PACKAGING CO., LTD.'s (Jiangsu, China) applicant profile with 1 patent applications submitted.

AssigneeID:

629006 ⎘