GIGADEVICE SEMICONDUCTOR INC.

City:

Haidian

Country:

China

Published Applications:

Last publication date:

2026-05-14

Patent Grants:

Last grant date:

2026-03-24

Top Inventors for applications by GIGADEVICE SEMICONDUCTOR INC.

These are the the leading inventors for applications assigned to GIGADEVICE SEMICONDUCTOR INC.:

Yong DU 1 Beijing, China
Yuanyuan LI 1 Beijing, China
Lipeng WU 1 Haidian, China
Yang Liu 1 Beijing, China

Recent patent applications by GIGADEVICE SEMICONDUCTOR INC.

GIGADEVICE SEMICONDUCTOR INC. based in Haidian, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-05-14

US20260136949A1

Electricity

PACKAGE STRUCTURE

#2 | 2024-11-14 ✅ Patent 12,587,204 granted on 2026-03-24

US20240380410A1

Electricity

CHANNEL SELECTION CIRCUIT, ANALOG-TO-DIGITAL CONVERTER AND SYSTEM-ON-CHIP

Also check out GIGADEVICE SEMICONDUCTOR INC.'s (Haidian, China) applicant profile with 3 patent applications submitted.

AssigneeID:

629472 ⎘