DEMCON BOND 3D B.V.

City:

Enschede

Country:

Netherlands

Published Applications:

Last publication date:

2024-01-18

Patent Grants:

Last grant date:

2026-04-07

Top Inventors for applications by DEMCON BOND 3D B.V.

These are the the leading inventors for applications assigned to DEMCON BOND 3D B.V.:

Tom WIMMENHOVE 2 Enschede, Netherlands
Bahri Sinan INANÇ 2 Enschede, Netherlands
Bahri Sinan Inanç 2 Enschede, Netherlands
Guus KUIPER 2 Enschede, Netherlands

Recent patent applications by DEMCON BOND 3D B.V.

DEMCON BOND 3D B.V. based in Enschede, NL has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-01-18 ✅ Patent 12,594,727 granted on 2026-04-07

US20240017496A1

Performing operations; transporting

EXTRUSION-BASED ADDITIVE MANUFACTURING: METHOD AND 3D PRINTING SYSTEM

#2 | 2023-01-05 ✅ Patent 12,151,439 granted on 2024-11-26

US20230001644A1

Performing operations; transporting

Extrusion-based additive manufacturing: method, 3D printing system, and 3D printed object

Also check out DEMCON BOND 3D B.V.'s (Enschede, Netherlands) applicant profile with 3 patent applications submitted.

AssigneeID:

630108 ⎘