SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.

City:

SHENZHEN

Country:

China

Published Applications:

Last publication date:

2025-04-17

Patent Grants:

Last grant date:

2026-04-21

Top Inventors for applications by SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.

These are the the leading inventors for applications assigned to SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.:

Yuhong LI 3 Shenzhen, China
GUANQIANG SONG 3 SHENZHEN, China
Shijie ZHONG 2 SHENZHEN, China
Jing Jiang 2 Shenzhen, China

Yun Lei 2 Shenzhen, China
CHENSHAN GAO 1 SHENZHEN, China
HAOYANG XIAO 1 SHENZHEN, China

Recent patent applications by SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.

SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD. based in SHENZHEN, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2025-04-17

US20250125306A1

Electricity

PACKAGING METHOD AND PACKAGING BODY

#2 | 2024-12-05

US20240404938A1

Electricity

PACKAGE BODY AND PREPARATION METHOD THEREFOR

#3 | 2024-01-18 ✅ Patent 12,610,847 granted on 2026-04-21

US20240021555A1

Electricity

PACKAGING METHOD AND PACKAGE MEMBER

Also check out SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.'s (SHENZHEN, China) applicant profile with 3 patent applications submitted.

AssigneeID:

631055 ⎘