Assignee profile:

MEKTEC CORPORATION

City:

Tokyo

Country:

Japan

Published Applications:

24

Last publication date:

2026-06-11

Patent Grants:

18

Last grant date:

2026-03-10

Top Inventors for applications by MEKTEC CORPORATION

These are the the leading inventors for applications assigned to MEKTEC CORPORATION:

Recent patent applications by MEKTEC CORPORATION

MEKTEC CORPORATION based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-06-11
US20260164540A1
Electricity

REINFORCING PLATE AND ELECTRICAL COMPONENT

#2 | 2026-05-07
US20260128396A1
Electricity

BATTERY MONITORING MODULE

#3 | 2026-01-15
US20260018743A1
Electricity

VOLTAGE MONITORING MODULE, BATTERY MODULE, AND SUPPORT CASE

#4 | 2025-12-25
US20250393120A1
Electricity

STRETCHABLE CIRCUIT BOARD

#5 | 2025-09-18
US20250290872A1
Physics

WETNESS DETECTION SENSOR SHEET, WETNESS DETECTION SENSOR SHEET SET, AND WETNESS DETECTION SYSTEM

#6 | 2025-05-29
US20250172620A1
Physics

VOLTAGE MONITORING MODULE AND BATTERY UNIT

#7 | 2024-11-07 ✅ Patent 12,569,179 granted on 2026-03-10
US20240366136A1
Human necessities

BIOLOGICAL INFORMATION ACQUISITION SYSTEM AND ELECTRODE SHEET

#8 | 2024-06-27 ✅ Patent 12,627,088 granted on 2026-05-12
US20240213698A1
Electricity

CONNECTOR-EQUIPPED FLEXIBLE PRINTED CIRCUIT BOARD

#9 | 2024-06-27 ✅ Patent 12,628,675 granted on 2026-05-12
US20240213136A1
Electricity

COMPONENT MOUNTING SUBSTRATE

#10 | 2024-06-20 ✅ Patent 12,588,153 granted on 2026-03-24
US20240206082A1
Electricity

ELECTRONIC EQUIPMENT SEALING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

#11 | 2024-06-06 ✅ Patent 12,553,952 granted on 2026-02-17
US20240183909A1
Physics

VOLTAGE MONITORING MODULE AND BATTERY UNIT

#12 | 2024-05-23 ✅ Patent 12,432,857 granted on 2025-09-30
US20240172366A1
Electricity

COMPONENT MOUNT BOARD

#13 | 2024-04-25 ✅ Patent 12,562,518 granted on 2026-02-24
US20240136740A1
Electricity

FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE

#14 | 2024-02-29 ✅ Patent 12,601,639 granted on 2026-04-14
US20240068885A1
Physics

TEMPERATURE MEASUREMENT DEVICE

#15 | 2023-12-07 ✅ Patent 12,546,667 granted on 2026-02-10
US20230392994A1
Physics

TEMPERATURE MEASUREMENT DEVICE

#16 | 2023-11-02 ✅ Patent 12,342,459 granted on 2025-06-24
US20230354522A1
Electricity

FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING

#17 | 2023-02-09 ✅ Patent 12,250,777 granted on 2025-03-11
US20230045335A1
Electricity

Method for manufacturing printed circuit board with electronic component, and printed circuit board with electronic component

#18 | 2022-12-22 ✅ Patent 12,523,544 granted on 2026-01-13
US20220404214A1
Physics

TEMPERATURE MEASUREMENT DEVICE

#19 | 2022-02-10 ✅ Patent 12,317,380 granted on 2025-05-27
US20220046766A1
Electricity

Cylindrical heater

#20 | 2022-02-10 ✅ Patent 12,362,420 granted on 2025-07-15
US20220045396A1
Electricity

SUPPORT MEMBER AND BATTERY MODULE

#21 | 2021-10-07 ✅ Patent 12,580,331 granted on 2026-03-17
US20210313719A1
Electricity

FLEXIBLE PRINTED WIRING BOARD WITH CRIMP TERMINAL

#22 | 2021-09-30 ✅ Patent 12,193,146 granted on 2025-01-07
US20210307155A1
Electricity

Heater including flexible printed wiring board and method for manufacturing same

#23 | 2021-06-03 ✅ Patent 12,312,510 granted on 2025-05-27
US20210163790A1
Chemistry; metallurgy

Adhesive film and flexible printed circuit board

#24 | 2020-09-17 ✅ Patent 12,286,573 granted on 2025-04-29
US20200291274A1
Chemistry; metallurgy

Adhesive sheet

Also check out MEKTEC CORPORATION's (Tokyo, Japan) applicant profile with 24 patent applications submitted.

AssigneeID:

633599 ⎘