Tokyo
Japan
24
2026-06-11
18
2026-03-10
These are the the leading inventors for applications assigned to MEKTEC CORPORATION:
MEKTEC CORPORATION based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
REINFORCING PLATE AND ELECTRICAL COMPONENT
#2 | 2026-05-07BATTERY MONITORING MODULE
#3 | 2026-01-15VOLTAGE MONITORING MODULE, BATTERY MODULE, AND SUPPORT CASE
#4 | 2025-12-25STRETCHABLE CIRCUIT BOARD
#5 | 2025-09-18WETNESS DETECTION SENSOR SHEET, WETNESS DETECTION SENSOR SHEET SET, AND WETNESS DETECTION SYSTEM
#6 | 2025-05-29VOLTAGE MONITORING MODULE AND BATTERY UNIT
#7 | 2024-11-07 ✅ Patent 12,569,179 granted on 2026-03-10BIOLOGICAL INFORMATION ACQUISITION SYSTEM AND ELECTRODE SHEET
#8 | 2024-06-27 ✅ Patent 12,627,088 granted on 2026-05-12CONNECTOR-EQUIPPED FLEXIBLE PRINTED CIRCUIT BOARD
#9 | 2024-06-27 ✅ Patent 12,628,675 granted on 2026-05-12COMPONENT MOUNTING SUBSTRATE
#10 | 2024-06-20 ✅ Patent 12,588,153 granted on 2026-03-24ELECTRONIC EQUIPMENT SEALING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#11 | 2024-06-06 ✅ Patent 12,553,952 granted on 2026-02-17VOLTAGE MONITORING MODULE AND BATTERY UNIT
#12 | 2024-05-23 ✅ Patent 12,432,857 granted on 2025-09-30COMPONENT MOUNT BOARD
#13 | 2024-04-25 ✅ Patent 12,562,518 granted on 2026-02-24FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE
#14 | 2024-02-29 ✅ Patent 12,601,639 granted on 2026-04-14TEMPERATURE MEASUREMENT DEVICE
#15 | 2023-12-07 ✅ Patent 12,546,667 granted on 2026-02-10TEMPERATURE MEASUREMENT DEVICE
#16 | 2023-11-02 ✅ Patent 12,342,459 granted on 2025-06-24FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING
#17 | 2023-02-09 ✅ Patent 12,250,777 granted on 2025-03-11Method for manufacturing printed circuit board with electronic component, and printed circuit board with electronic component
#18 | 2022-12-22 ✅ Patent 12,523,544 granted on 2026-01-13TEMPERATURE MEASUREMENT DEVICE
#19 | 2022-02-10 ✅ Patent 12,317,380 granted on 2025-05-27Cylindrical heater
#20 | 2022-02-10 ✅ Patent 12,362,420 granted on 2025-07-15SUPPORT MEMBER AND BATTERY MODULE
#21 | 2021-10-07 ✅ Patent 12,580,331 granted on 2026-03-17FLEXIBLE PRINTED WIRING BOARD WITH CRIMP TERMINAL
#22 | 2021-09-30 ✅ Patent 12,193,146 granted on 2025-01-07Heater including flexible printed wiring board and method for manufacturing same
#23 | 2021-06-03 ✅ Patent 12,312,510 granted on 2025-05-27Adhesive film and flexible printed circuit board
#24 | 2020-09-17 ✅ Patent 12,286,573 granted on 2025-04-29Adhesive sheet
Also check out MEKTEC CORPORATION's (Tokyo, Japan) applicant profile with 24 patent applications submitted.
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