Myeong-Eun HWANG

City:

Seoul

Country:

South Korea

Published Applications:

Last publication date:

2025-10-30

Patent Grants:

Last grant date:

2025-07-08

Top Inventors for applications by Myeong-Eun HWANG

These are the the leading inventors for applications assigned to Myeong-Eun HWANG:

Myeong-Eun HWANG 2 Seoul, South Korea
In Suh HWANG 1 Seoul, South Korea
In Suh Hwang 1 Seongnam-si, South Korea

Recent patent applications by Myeong-Eun HWANG

Myeong-Eun HWANG based in Seoul, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2025-10-30

US20250338626A1

Electricity

HIGH BANDWIDTH DOUBLE-SIDED INTEGRATED CIRCUIT DIE AND INTEGRATED CIRCUIT PACKAGE INCLUDING THE SAME

#2 | 2025-05-08 ✅ Patent 12,356,724 granted on 2025-07-08

US20250151411A1

Electricity

INTEGRATED CIRCUIT DIE AND INTEGRATED CIRCUIT PACKAGE INCLUDING THE SAME

Also check out Myeong-Eun HWANG's (Seoul, South Korea) applicant profile with 3 patent applications submitted.

AssigneeID:

642801 ⎘