Kallang
Singapore
4
2014-05-15
4
2015-06-16
These are the the leading inventors for applications assigned to ADVANPACK SOLUTIONS PTE. LTD.:
ADVANPACK SOLUTIONS PTE. LTD. based in Kallang, SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Manufacturing methods of semiconductor substrate, package and device
#2 | 2011-09-01 ✅ Patent 9,136,215 granted on 2015-09-15Manufacturing method for semiconductor package
#3 | 2011-09-01 ✅ Patent 9,847,268 granted on 2017-12-19Semiconductor package and manufacturing method thereof
#4 | 2011-09-01 ✅ Patent 8,664,750 granted on 2014-03-04Semiconductor substrate, package and device
Also check out ADVANPACK SOLUTIONS PTE. LTD.'s (Kallang, Singapore) applicant profile with 1 patent applications submitted.
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