Arisawa MFG. Co., Ltd.

City:

Country:

Japan

Published Applications:

Last publication date:

2024-08-15

Patent Grants:

Last grant date:

2025-07-08

Top Inventors for applications by Arisawa MFG. Co., Ltd.

These are the the leading inventors for applications assigned to Arisawa MFG. Co., Ltd.:

Toshio Nakamura 2 Niigata, Japan
Masaaki Hirai 2 Niigata, Japan
Hiroyuki MATSUYAMA 1 Niigata, Japan
Yoshihiko Konno 1 Niigata, Japan

Yoshinori SATO 1 Niigata, Japan

Recent patent applications by Arisawa MFG. Co., Ltd.

Arisawa MFG. Co., Ltd. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-08-15 ✅ Patent 12,351,684 granted on 2025-07-08

US20240270907A1

Chemistry; metallurgy

POLYIMIDE RESIN PRECURSOR, POLYIMIDE RESIN, METAL-CLAD LAMINATED BOARD, LAMINATE, AND FLEXIBLE PRINTED WIRING BOARD

#2 | 2024-08-15 ✅ Patent 12,616,403 granted on 2026-05-05

US20240269959A1

Performing operations; transporting

THERMALLY INSULATED CONTAINER AND MAGNETOSPINOGRAPH USING SAME

#3 | 2024-05-30 ✅ Patent 12,571,859 granted on 2026-03-10

US20240175944A1

Physics

THERMAL-INSULATION CONTAINER AND MAGNETOSPINOGRAPH USING SAME

AssigneeID:

656084 ⎘