Assignee profile:

Modula S, Inc.

City:

Ketchum, Idaho

Country:

United States

Published Applications:

1

Last publication date:

2017-07-11

Patent Grants:

1

Last grant date:

2017-07-11

Top Inventors for applications by Modula S, Inc.

These are the the leading inventors for applications assigned to Modula S, Inc.:

Recent patent applications by Modula S, Inc.

Modula S, Inc. based in Ketchum, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

AssigneeID:

659625 ⎘