Bala Cynwyd, Pennsylvania
United States
8
2014-06-05
7
2013-06-04
These are the the leading inventors for applications assigned to Summit Technology Systems, LP:
Summit Technology Systems, LP based in Bala Cynwyd, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
SYSTEM AND METHOD OF COMMUNICATION USING AT LEAST TWO MODULATION METHODS
#2 | 2012-05-03 ✅ Patent 8,457,228 granted on 2013-06-04System and method of communication using at least two modulation methods
#3 | 2010-06-08 ✅ Patent 7,733,966 granted on 2010-06-08System and method for space diversified linear block interleaving
#4 | 2008-12-30 ✅ Patent 7,471,777 granted on 2008-12-30Indirect DSL over loaded and unloaded loops
#5 | 2008-01-17 ✅ Patent 7,675,965 granted on 2010-03-09System and method of communication via embedded modulation
#6 | 2007-10-30 ✅ Patent 7,289,610 granted on 2007-10-30Digital subscriber line service over loaded loops
#7 | 2006-08-31 ✅ Patent 7,707,446 granted on 2010-04-27System and method for minimized power consumption for frame and cell data transmission systems
#8 | 2005-10-13 ✅ Patent 7,684,444 granted on 2010-03-23Communication system and method for minimum burst duration
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