HSINCHU
Taiwan
59
2014-07-03
40
2014-04-29
These are the the leading inventors for applications assigned to LEXTAR ELECTRONICS CORP.:
LEXTAR ELECTRONICS CORP. based in HSINCHU, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF
#2 | 2013-10-24LIGHT MODULE AND LIGHT GUIDE DEVICE THEREOF
#3 | 2013-10-03 ✅ Patent 8,710,530 granted on 2014-04-29Light emitted diode
#4 | 2013-09-19LIGHT-EMITTING DEVICE
#5 | 2013-08-08LED LIGHTING APPARATUS AND DIMMING METHOD THEREOF
#6 | 2013-08-08SOLID-STATE LIGHT EMITTING DEVICE
#7 | 2013-07-11LUMINOUS CIRCUIT AND LUMINOUS DEVICE HAVING THE SAME
#8 | 2013-07-11ZENER DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF
#9 | 2013-07-04SOLID-STATE LIGHT-EMITTING DEVICE AND SOLID-STATE LIGHT-EMITTING PACKAGE THEREOF
#10 | 2013-06-27 ✅ Patent 8,760,077 granted on 2014-06-24Plant illumination apparatus
#11 | 2013-06-20OVER VOLTAGE PROTECTION CIRCUIT AND DRIVER CIRCUIT USING THE SAME
#12 | 2013-04-04 ✅ Patent 8,602,598 granted on 2013-12-10Light source cooling device and cooling method thereof
#13 | 2013-02-07LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF
#14 | 2013-01-31DICING PROCESS AND DICING APPARATUS
#15 | 2013-01-31LED STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
#16 | 2012-09-13 ✅ Patent 8,716,735 granted on 2014-05-06Light-emitting diode with metal structure and heat sink
#17 | 2012-08-02LAMP
#18 | 2012-08-02SEMICONDUCTOR LIGHT EMITTING STRUCTURE
#19 | 2012-08-02LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF
#20 | 2012-06-28 ✅ Patent 8,445,327 granted on 2013-05-21Light-emitting diode package and wafer-level packaging process of light-emitting diode
#21 | 2012-06-28WAFER SPLITTING APPARATUS AND WAFER SPLITTING PROCESS
#22 | 2012-06-21 ✅ Patent 8,253,160 granted on 2012-08-28Light-emitting diode chip structure and fabrication method thereof
#23 | 2012-06-07 ✅ Patent 8,421,858 granted on 2013-04-16Inspection machine, inspecting method and inspecting system
#24 | 2012-05-17 ✅ Patent 8,508,114 granted on 2013-08-13Light emitting diode
#25 | 2012-01-26METHOD FOR TRANSFERRING CHIP AND APPARATUS FOR TRANSFERRING CHIP
#26 | 2011-12-29 ✅ Patent 8,101,440 granted on 2012-01-24Method for fabricating light emitting diode chip
#27 | 2011-12-29 ✅ Patent 8,283,188 granted on 2012-10-09Method for fabricating light emitting diode chip
#28 | 2011-12-29 ✅ Patent 8,530,771 granted on 2013-09-10Surface mount process, surface mount system, and feeding apparatus thereof
#29 | 2011-11-24LIGHT EMITTING DIODE CHIP AND MANUFACTURING METHOD THEREOF
#30 | 2011-10-06 ✅ Patent 8,373,179 granted on 2013-02-12Light emitting diode
#31 | 2011-09-29 ✅ Patent 8,471,285 granted on 2013-06-25Light-emitting diode package including a cavity with a plurality of side-walls with different inclinations
#32 | 2011-07-07 ✅ Patent 8,173,467 granted on 2012-05-08Method for fabricating LED chip comprising reduced mask count and lift-off processing
#33 | 2011-07-07 ✅ Patent 8,173,468 granted on 2012-05-08Method for fabricating LED chip comprising reduced mask count and lift-off processing
#34 | 2011-06-30 ✅ Patent 8,173,466 granted on 2012-05-08Method for fabricating LED chip comprising reduced mask count and lift-off processing
#35 | 2011-06-30 ✅ Patent 8,178,377 granted on 2012-05-15Method for fabricating lED chip comprising reduced mask count
#36 | 2011-06-30 ✅ Patent 8,178,376 granted on 2012-05-15Method for fabricating LED chip comprising reduced mask count and lift-off processing
#37 | 2011-06-30 ✅ Patent 8,173,465 granted on 2012-05-08Method for fabricating LED chip comprising reduced mask count and lift-off processing
#38 | 2011-03-10WHITE-LIGHT EMITTING DEVICE
#39 | 2011-02-24 ✅ Patent 8,329,487 granted on 2012-12-11Fabricating method of light emitting diode chip
#40 | 2010-12-30 ✅ Patent 8,092,046 granted on 2012-01-10LED lighting device
#41 | 2010-12-02 ✅ Patent 8,294,173 granted on 2012-10-23Light emitting element
#42 | 2010-11-11 ✅ Patent 8,071,409 granted on 2011-12-06Fabrication method of light emitting diode
#43 | 2010-10-14 ✅ Patent 8,012,777 granted on 2011-09-06Packaging process of light emitting diode
#44 | 2010-10-14 ✅ Patent 8,278,681 granted on 2012-10-02Light-emitting diode package and wafer-level packaging process of light-emitting diode
#45 | 2010-10-14 ✅ Patent 8,415,683 granted on 2013-04-09Light emitting diode chip
#46 | 2010-09-23 ✅ Patent 7,935,981 granted on 2011-05-03Light emitting diode package
#47 | 2010-08-12 ✅ Patent 8,304,993 granted on 2012-11-06Separate LED lamp tube and light source module formed therefrom
#48 | 2010-07-29 ✅ Patent 7,985,003 granted on 2011-07-26Light-emitting member and its forming mold
#49 | 2010-07-29 ✅ Patent 8,147,092 granted on 2012-04-03Illuminating device
#50 | 2010-07-01 ✅ Patent 8,043,873 granted on 2011-10-25Method for fabricating light emitting diode chip
#51 | 2010-06-17 ✅ Patent 7,989,819 granted on 2011-08-02Light emitting diode
#52 | 2010-06-03 ✅ Patent 8,084,779 granted on 2011-12-27Casting for an LED module
#53 | 2010-03-25 ✅ Patent 8,049,244 granted on 2011-11-01Package substrate and light emitting device using the same
#54 | 2010-02-11 ✅ Patent 8,193,540 granted on 2012-06-05SMD diode holding structure and package thereof
#55 | 2010-01-21 ✅ Patent 7,927,901 granted on 2011-04-19Method for fabricating LED chip comprising reduced mask count and lift-off processing
#56 | 2010-01-21 ✅ Patent 8,008,686 granted on 2011-08-30Light emitting diode chip
#57 | 2009-10-29 ✅ Patent 8,030,674 granted on 2011-10-04Light-emitting diode package with roughened surface portions of the lead-frame
#58 | 2008-06-26 ✅ Patent 8,125,136 granted on 2012-02-28Light emission diode
#59 | 2008-04-03 ✅ Patent 7,926,984 granted on 2011-04-19Light source having LED and frame structure
Also check out Lextar Electronics Corp.'s (Hsinchu, Taiwan) applicant profile with 1 patent applications submitted.
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