Assignee profile:

Seed Co., Ltd.

City:

Osaka

Country:

Japan

Published Applications:

1

Last publication date:

2007-02-20

Patent Grants:

1

Last grant date:

2007-02-20

Top Inventors for applications by Seed Co., Ltd.

These are the the leading inventors for applications assigned to Seed Co., Ltd.:

Recent patent applications by Seed Co., Ltd.

Seed Co., Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

AssigneeID:

676001 ⎘