Fremont, California
United States
25
2006-12-12
25
2006-12-12
These are the the leading inventors for applications assigned to ASM NuTool, Inc.:
ASM NuTool, Inc. based in Fremont, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Chip interconnect and packaging deposition methods and structures
#2 | 2006-06-13 ✅ Patent 7,059,944 granted on 2006-06-13Integrated system for processing semiconductor wafers
#3 | 2006-05-16 ✅ Patent 7,045,040 granted on 2006-05-16Process and system for eliminating gas bubbles during electrochemical processing
#4 | 2006-04-18 ✅ Patent 7,029,567 granted on 2006-04-18Electrochemical edge and bevel cleaning process and system
#5 | 2006-01-24 ✅ Patent 6,988,932 granted on 2006-01-24Apparatus of sealing wafer backside for full-face processing
#6 | 2005-12-13 ✅ Patent 6,974,769 granted on 2005-12-13Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization
#7 | 2005-11-29 ✅ Patent 6,969,456 granted on 2005-11-29Method of using vertically configured chamber used for multiple processes
#8 | 2005-11-22 ✅ Patent 6,967,166 granted on 2005-11-22Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing
#9 | 2005-10-25 ✅ Patent 6,958,114 granted on 2005-10-25Method and apparatus for forming an electrical contact with a semiconductor substrate
#10 | 2005-10-11 ✅ Patent 6,953,392 granted on 2005-10-11Integrated system for processing semiconductor wafers
#11 | 2005-09-20 ✅ Patent 6,946,066 granted on 2005-09-20Multi step electrodeposition process for reducing defects and minimizing film thickness
#12 | 2005-09-13 ✅ Patent 6,942,780 granted on 2005-09-13Method and apparatus for processing a substrate with minimal edge exclusion
#13 | 2005-09-13 ✅ Patent 6,943,112 granted on 2005-09-13Defect-free thin and planar film processing
#14 | 2005-09-13 ✅ Patent 6,942,546 granted on 2005-09-13Endpoint detection for non-transparent polishing member
#15 | 2005-09-06 ✅ Patent 6,939,203 granted on 2005-09-06Fluid bearing slide assembly for workpiece polishing
#16 | 2005-09-06 ✅ Patent 6,939,206 granted on 2005-09-06Method and apparatus of sealing wafer backside for full-face electrochemical plating
#17 | 2005-08-30 ✅ Patent 6,936,154 granted on 2005-08-30Planarity detection methods and apparatus for electrochemical mechanical processing systems
#18 | 2005-08-23 ✅ Patent 6,932,679 granted on 2005-08-23Apparatus and method for loading a wafer in polishing system
#19 | 2005-08-09 ✅ Patent 6,926,589 granted on 2005-08-09Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing
#20 | 2005-07-26 ✅ Patent 6,921,551 granted on 2005-07-26Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
#21 | 2005-06-21 ✅ Patent 6,908,368 granted on 2005-06-21Advanced Bi-directional linear polishing system and method
#22 | 2005-06-14 ✅ Patent 6,905,588 granted on 2005-06-14Packaging deposition methods
#23 | 2005-06-07 ✅ Patent 6,902,659 granted on 2005-06-07Method and apparatus for electro-chemical mechanical deposition
#24 | 2005-04-26 ✅ Patent 6,884,334 granted on 2005-04-26Vertically configured chamber used for multiple processes
#25 | 2005-03-15 ✅ Patent 6,866,763 granted on 2005-03-15Method and system monitoring and controlling film thickness profile during plating and electroetching
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