THE PACK CORPORATION

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2014-06-19

Patent Grants:

Last grant date:

2014-07-22

Top Inventors for applications by THE PACK CORPORATION

These are the the leading inventors for applications assigned to THE PACK CORPORATION:

Takeshi Fukuta 1 Nara, Japan
Kyosuke Miyata 1 Osaka, Japan
Ryoji Shigemoto 1 Osaka, Japan
Shuji Sugimoto 1 Hyogo, Japan

Recent patent applications by THE PACK CORPORATION

THE PACK CORPORATION based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2014-06-19 ✅ Patent 8,783,462 granted on 2014-07-22

US20140166532A1

Performing operations; transporting

Packaging construction

AssigneeID:

68386 ⎘