St Assembly Test Services Pte.

City:

Singapore

Country:

Singapore

Published Applications:

Last publication date:

2006-07-25

Patent Grants:

Last grant date:

2006-07-25

Top Inventors for applications by St Assembly Test Services Pte.

These are the the leading inventors for applications assigned to St Assembly Test Services Pte.:

Kai Wah Sum 1 Singapore, Singapore
Wee Boon Tan 1 Singapore, Singapore
John Briar 1 Singapore, Singapore
Liop Jin Yap 1 Singapore, Singapore

Recent patent applications by St Assembly Test Services Pte.

St Assembly Test Services Pte. based in Singapore, SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-07-25 ✅ Patent 7,081,668 granted on 2006-07-25

US10693217

Flip chip molded/exposed die process and package structure

#2 | 2006-07-18 ✅ Patent 7,076,861 granted on 2006-07-18

US10745149

Multi-package conversion kit for a pick and place handler

AssigneeID:

685657 ⎘