Assignee profile:

Neff Packaging, Inc.

City:

Dayton, Ohio

Country:

United States

Published Applications:

1

Last publication date:

2006-05-02

Patent Grants:

1

Last grant date:

2006-05-02

Top Inventors for applications by Neff Packaging, Inc.

These are the the leading inventors for applications assigned to Neff Packaging, Inc.:

Recent patent applications by Neff Packaging, Inc.

Neff Packaging, Inc. based in Dayton, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

AssigneeID:

688266 ⎘