Reutte
Austria
4
2006-02-14
4
2006-02-14
These are the the leading inventors for applications assigned to Plansee Aktiengesellschaft:
Plansee Aktiengesellschaft based in Reutte, AT has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Package with a substrate of high thermal conductivity
#2 | 2005-07-05 ✅ Patent 6,914,330 granted on 2005-07-05Heat sink formed of diamond-containing composite material with a multilayer coating
#3 | 2005-06-21 ✅ Patent 6,908,588 granted on 2005-06-21Process for manufacturing an evaporation source
#4 | 2005-06-21 ✅ Patent 6,907,661 granted on 2005-06-21Method of joining a high-temperature material composite component
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