Haruna Co., Ltd.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2006-02-07

Patent Grants:

Last grant date:

2006-02-07

Top Inventors for applications by Haruna Co., Ltd.

These are the the leading inventors for applications assigned to Haruna Co., Ltd.:

Tsuyoshi Asano 1 Kobe, Japan

Recent patent applications by Haruna Co., Ltd.

Haruna Co., Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-02-07 ✅ Patent 6,994,540 granted on 2006-02-07

US9988499

Injection molding system and pellet feeding unit

AssigneeID:

691347 ⎘