Telephus Inc.

City:

Country:

South Korea

Published Applications:

Last publication date:

2005-08-16

Patent Grants:

Last grant date:

2005-08-16

Top Inventors for applications by Telephus Inc.

These are the the leading inventors for applications assigned to Telephus Inc.:

Telephus Inc. based in , KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same

AssigneeID:

696714 ⎘