Assignee profile:

RUBICON TECHNOLOGY, INC.

City:

Bensenville, Illinois

Country:

United States

Published Applications:

14

Last publication date:

2016-07-12

Patent Grants:

8

Last grant date:

2016-07-12

Top Inventors for applications by RUBICON TECHNOLOGY, INC.

These are the the leading inventors for applications assigned to RUBICON TECHNOLOGY, INC.:

Recent patent applications by RUBICON TECHNOLOGY, INC.

RUBICON TECHNOLOGY, INC. based in Bensenville, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2016-07-12 ✅ Patent 9,390,906 granted on 2016-07-12
US14073602
Electricity

Method for creating asymmetrical wafer

#2 | 2016-01-14
US20160008926A1
Performing operations; transporting

METHOD OF COLD-CLEAVING SAPPHIRE MATERIAL AT CRYOGENIC TEMPERATURES

#3 | 2015-10-29
US20150308013A1
Chemistry; metallurgy

METHOD OF PRODUCING FREE-STANDING NET-SHAPE SAPPHIRE

#4 | 2015-04-02 ✅ Patent 9,134,260 granted on 2015-09-15
US20150092920A1
Physics

Intelligent machines and process for production of monocrystalline products with goniometer continual feedback

#5 | 2015-01-22
US20150023866A1
Chemistry; metallurgy

METHOD AND SYSTEM OF PRODUCING LARGE OXIDE CRYSTALS FROM A MELT

#6 | 2014-09-18
US20140272346A1
Chemistry; metallurgy

METHOD OF GROWING ALUMINUM OXIDE ONTO SUBSTRATES BY USE OF AN ALUMINUM SOURCE IN AN OXYGEN ENVIRONMENT TO CREATE TRANSPARENT, SCRATCH RESISTANT WINDOWS

#7 | 2014-09-18
US20140272345A1
Chemistry; metallurgy

METHOD OF GROWING ALUMINUM OXIDE ONTO SUBSTRATES BY USE OF AN ALUMINUM SOURCE IN AN ENVIRONMENT CONTAINING PARTIAL PRESSURE OF OXYGEN TO CREATE TRANSPARENT, SCRATCH-RESISTANT WINDOWS

#8 | 2014-05-27 ✅ Patent 8,734,207 granted on 2014-05-27
US13911828
-

Ultra-flat, high throughput wafer lapping process

#9 | 2014-03-27
US20140082947A1
Performing operations; transporting

METHOD FOR CREATING ATOMICALLY SHARP EDGES ON OBJECTS MADE OF CRYSTAL MATERIAL

#10 | 2013-07-09 ✅ Patent 8,480,456 granted on 2013-07-09
US13687261
-

Ultra-flat, high throughput wafer lapping process

#11 | 2013-03-05 ✅ Patent 8,389,099 granted on 2013-03-05
US11756899
-

Asymmetrical wafer configurations and method for creating the same

#12 | 2013-01-31 ✅ Patent 8,934,606 granted on 2015-01-13
US20130028385A1
Physics

Intelligent machines and process for production of monocrystalline products with goniometer continual feedback

#13 | 2013-01-08 ✅ Patent 8,348,720 granted on 2013-01-08
US11769700
-

Ultra-flat, high throughput wafer lapping process

#14 | 2012-09-04 ✅ Patent 8,259,901 granted on 2012-09-04
US12787339
-

Intelligent machines and process for production of monocrystalline products with goniometer continual feedback

Also check out Rubicon Technology, Inc.'s (Bensenville, United States) applicant profile with 2 patent applications submitted.

AssigneeID:

6995 ⎘