Santa Clara, California
United States
7
2026-06-09
7
2026-06-09
These are the the leading inventors for applications assigned to Eliyan Corp.:
Eliyan Corp. based in Santa Clara, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Chiplet-based multi-chip module with die-to-die (D2D) interface that employs bandwidth balancing circuitry
#2 | 2026-04-14 ✅ Patent 12,602,531 granted on 2026-04-14Multi-chip module (MCM) with multi-port unified memory
#3 | 2026-03-17 ✅ Patent 12,579,093 granted on 2026-03-17Chiplet gearbox for low-cost multi-chip module applications
#4 | 2026-01-13 ✅ Patent 12,524,300 granted on 2026-01-13Die-to-die (D2D) interface with cyclic redundancy check (CRC) error correction capability
#5 | 2026-01-13 ✅ Patent 12,525,540 granted on 2026-01-13Multi-chip module (MCM) with scalable high bandwidth memory
#6 | 2025-12-09 ✅ Patent 12,494,469 granted on 2025-12-09Low cost solution for 2.5D and 3D packaging using USR chiplets
#7 | 2025-10-07 ✅ Patent 12,438,095 granted on 2025-10-07Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
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