Tokyo
Japan
26
2025-07-10
26
2026-06-23
These are the the leading inventors for applications assigned to Yamaha Robotics Co., Ltd.:
Yamaha Robotics Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
RESIN SEALING APPARATUS AND SEALING MOLD
#2 | 2025-05-22 ✅ Patent 12,485,586 granted on 2025-12-02MOLD CLAMPING DEVICE
#3 | 2024-12-26 ✅ Patent 12,487,206 granted on 2025-12-02DEFECT DETECTION DEVICE AND DEFECT DETECTION METHOD
#4 | 2024-12-19 ✅ Patent 12,479,135 granted on 2025-11-25RESIN-SEALING METHOD
#5 | 2024-11-28 ✅ Patent 12,485,460 granted on 2025-12-02ACOUSTIC FOREIGN MATTER REMOVAL DEVICE
#6 | 2024-09-26 ✅ Patent 12,480,762 granted on 2025-11-25MOUNTING DEVICE, AND METHOD FOR DETECTING DEGREE OF PARALLELISM OF MOUNTING DEVICE
#7 | 2024-08-22 ✅ Patent 12,469,727 granted on 2025-11-11DEFECT DETECTION DEVICE AND DEFECT DETECTION METHOD
#8 | 2024-08-01 ✅ Patent 12,494,386 granted on 2025-12-09ELECTRONIC COMPONENT CLEANING APPARATUS
#9 | 2024-07-18 ✅ Patent 12,489,003 granted on 2025-12-02WIRE BONDING SYSTEM, INSPECTION DEVICE, WIRE BONDING METHOD, AND RECORDING MEDIUM
#10 | 2024-05-16 ✅ Patent 12,666,915 granted on 2026-06-23MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM
#11 | 2024-04-18 ✅ Patent 12,475,551 granted on 2025-11-18MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#12 | 2024-04-11 ✅ Patent 12,643,268 granted on 2026-06-02COMPRESSION MOLDING DEVICE
#13 | 2024-03-14 ✅ Patent 12,616,049 granted on 2026-04-28WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM RECORDING PROGRAM
#14 | 2024-02-15 ✅ Patent 12,635,549 granted on 2026-05-19BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM
#15 | 2023-12-07 ✅ Patent 12,487,076 granted on 2025-12-02MEASUREMENT DEVICE, MEASUREMENT METHOD, AND BONDING SYSTEM
#16 | 2023-11-30 ✅ Patent 12,589,529 granted on 2026-03-31RESIN SEALING APPARATUS
#17 | 2023-11-16 ✅ Patent 12,489,004 granted on 2025-12-02SURFACE TREATMENT APPARATUS AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE
#18 | 2023-08-31 ✅ Patent 12,557,682 granted on 2026-02-17MOUNTING DEVICE AND MOUNTING METHOD
#19 | 2023-08-31 ✅ Patent 12,638,830 granted on 2026-05-26POSITION CONTROL APPARATUS, POSITION CONTROL METHOD, POSITION CONTROL RECORDING MEDIUM, AND BONDING APPARATUS
#20 | 2023-06-22 ✅ Patent 12,519,003 granted on 2026-01-06TRANSFER APPARATUS
#21 | 2023-06-08 ✅ Patent 12,551,926 granted on 2026-02-17ULTRASONIC HORN
#22 | 2023-05-18 ✅ Patent 12,568,792 granted on 2026-03-03SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
#23 | 2022-11-10 ✅ Patent 12,563,999 granted on 2026-02-24MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#24 | 2022-10-20 ✅ Patent 12,557,600 granted on 2026-02-17SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
#25 | 2022-10-06 ✅ Patent 12,476,219 granted on 2025-11-18WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETERMINATION DEVICE
#26 | 2022-07-14 ✅ Patent 12,575,368 granted on 2026-03-10APPARATUS FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
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