Evec Inc.

City:

Sapporo

Country:

Japan

Published Applications:

Last publication date:

2014-07-24

Patent Grants:

Last grant date:

2014-03-25

Top Inventors for applications by Evec Inc.

These are the the leading inventors for applications assigned to Evec Inc.:

Kantou Nakajima 3 Sapporo, Japan
Kenzo Takada 2 Sapporo, Japan
Barbara Kistler 2 Ingelheim Am Rhein, Germany
John Park 2 Ingelheim Am Rhein, Germany

Kantou Nakajima 1 Sapporo-shi, Japan

Recent patent applications by Evec Inc.

Evec Inc. based in Sapporo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2014-07-24

US20140205611A1

Chemistry; metallurgy

MONOCLONAL ANTIBODIES THAT BIND TO HGM-CSF AND MEDICAL COMPOSITIONS COMPRISING SAME

#2 | 2011-07-28 ✅ Patent 8,679,502 granted on 2014-03-25

US20110182905A1

Chemistry; metallurgy

Monoclonal antibodies that bind to HGM-CSF and medical compositions comprising same

#3 | 2008-12-25 ✅ Patent 7,935,795 granted on 2011-05-03

US20080317757A1

Chemistry; metallurgy

Human monoclonal antibody binding to hGM-CSF and its antigen binding portion

AssigneeID:

72273 ⎘