Windbond Electronics Corp.

City:

Taichung City

Country:

Taiwan

Published Applications:

Last publication date:

2023-10-12

Patent Grants:

Last grant date:

2026-05-19

Top Inventors for applications by Windbond Electronics Corp.

These are the the leading inventors for applications assigned to Windbond Electronics Corp.:

Masaru Yano 1 Kanagawa, Japan

Recent patent applications by Windbond Electronics Corp.

Windbond Electronics Corp. based in Taichung City, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-10-12 ✅ Patent 12,633,352 granted on 2026-05-19

US20230326533A1

Physics

MEMORY DEVICE CAPABLE OF OPERATING MULTIPLE PLANES SIMULTANEOUSLY

AssigneeID:

726096 ⎘