Helsinki
Finland
26
2018-12-06
25
2019-11-05
These are the the leading inventors for applications assigned to GE EMBEDDED ELECTRONICS OY:
GE EMBEDDED ELECTRONICS OY based in Helsinki, FI has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Electronic module with EMI protection
#2 | 2017-05-04 ✅ Patent 9,820,375 granted on 2017-11-14Rigid-flex module and manufacturing method
#3 | 2016-11-10 ✅ Patent 9,674,948 granted on 2017-06-06Rigid-flex electronic module
#4 | 2016-07-21 ✅ Patent 9,883,587 granted on 2018-01-30Circuit module and method of manufacturing the same
#5 | 2016-06-16 ✅ Patent 9,999,136 granted on 2018-06-12Method for fabrication of an electronic module and electronic module
#6 | 2015-12-03 ✅ Patent 9,324,647 granted on 2016-04-26Circuit module and method of manufacturing the same
#7 | 2015-10-08 ✅ Patent 10,085,347 granted on 2018-09-25Manufacture of a circuit board and circuit board containing a component
#8 | 2015-06-11 ✅ Patent 10,010,019 granted on 2018-06-26Electronic module with EMI protection
#9 | 2015-06-11 ✅ Patent 9,363,898 granted on 2016-06-07Method for manufacturing an electronic module and an electronic module
#10 | 2015-02-12 ✅ Patent 10,085,345 granted on 2018-09-25Electronic module
#11 | 2014-09-11 ✅ Patent 10,231,335 granted on 2019-03-12Electronic module with embedded jumper conductor
#12 | 2014-07-31 ✅ Patent 9,107,324 granted on 2015-08-11Circuit module and method of manufacturing the same
#13 | 2014-07-31Method for manufacturing an electronic module and an electronic module
#14 | 2014-05-15 ✅ Patent 9,691,724 granted on 2017-06-27Multi-chip package and manufacturing method
#15 | 2014-03-06 ✅ Patent 9,622,354 granted on 2017-04-11Method for manufacturing a circuit board structure
#16 | 2013-07-11 ✅ Patent 9,301,394 granted on 2016-03-29Manufacturing method and electronic module with new routing possibilities
#17 | 2012-03-01 ✅ Patent 9,420,694 granted on 2016-08-16Method for controlling warpage within electronic products and an electronic product
#18 | 2012-01-26 ✅ Patent 8,735,735 granted on 2014-05-27Electronic module with embedded jumper conductor
#19 | 2011-12-01 ✅ Patent 8,704,359 granted on 2014-04-22Method for manufacturing an electronic module and an electronic module
#20 | 2011-03-17 ✅ Patent 8,699,233 granted on 2014-04-15Circuit module and method of manufacturing the same
#21 | 2010-08-12 ✅ Patent 8,964,409 granted on 2015-02-24Electronic module with EMI protection
#22 | 2010-07-29 ✅ Patent 9,232,658 granted on 2016-01-05Method for manufacturing an electronic module
#23 | 2010-07-08 ✅ Patent 9,425,158 granted on 2016-08-23Rigid-flex module and manufacturing method
#24 | 2010-04-29 ✅ Patent 8,817,485 granted on 2014-08-26Single-layer component package
#25 | 2010-03-04 ✅ Patent 8,659,134 granted on 2014-02-25Multi-chip package and manufacturing method
#26 | 2009-05-28 ✅ Patent 8,984,746 granted on 2015-03-24Manufacture of a circuit board containing a component
Also check out GE Embedded Electronics Oy's (Helsinki, Finland) applicant profile with 9 patent applications submitted.
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