Assignee profile:

1366 TECHNOLOGIES, INC.

City:

Bedford, Massachusetts

Country:

United States

Published Applications:

15

Last publication date:

2019-12-26

Patent Grants:

13

Last grant date:

2020-09-08

Top Inventors for applications by 1366 TECHNOLOGIES, INC.

These are the the leading inventors for applications assigned to 1366 TECHNOLOGIES, INC.:

Recent patent applications by 1366 TECHNOLOGIES, INC.

1366 TECHNOLOGIES, INC. based in Bedford, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2019-12-26 ✅ Patent 10,770,613 granted on 2020-09-08
US20190393375A1
Electricity

Methods for creating a semiconductor wafer having profiled doping and wafers and solar cell components having a profiled field, such as drift and back surface

#2 | 2018-05-03 ✅ Patent 10,633,765 granted on 2020-04-28
US20180119309A1
Chemistry; metallurgy

Method for maintaining contained volume of molten material from which material is depleted and replenished

#3 | 2018-01-18 ✅ Patent 10,439,095 granted on 2019-10-08
US20180019365A1
Electricity

Methods for creating a semiconductor wafer having profiled doping and wafers and solar cell components having a profiled field, such as drift and back surface

#4 | 2017-02-23 ✅ Patent 10,072,351 granted on 2018-09-11
US20170051429A1
Chemistry; metallurgy

Methods and apparati for making thin semi-conductor wafers with locally controlled regions that are relatively thicker than other regions and such wafers

#5 | 2015-11-26 ✅ Patent 9,425,346 granted on 2016-08-23
US20150340540A1
Electricity

Methods of imprint patterning of irregular surface

#6 | 2015-02-05
US20150037923A1
Electricity

METHODS TO SELECTIVELY TREAT PORTIONS OF A SURFACE USING A SELF-REGISTERING MASK

#7 | 2015-02-05
US20150037922A1
Electricity

TECHNIQUES FOR IMPROVED IMPRINTING OF SOFT MATERIAL ON SUBSTRATE USING STAMP INCLUDING UNDERFILLING TO LEAVE A GAP AND PULSING STAMP

#8 | 2014-12-18 ✅ Patent 10,549,476 granted on 2020-02-04
US20140367887A1
Performing operations; transporting

Methods and apparati for handling, heating and cooling a substrate upon which a pattern is made by a tool in heat flowable material coating, including substrate transport, tool laydown, tool tensioning and tool retraction

#9 | 2014-09-11 ✅ Patent 9,815,072 granted on 2017-11-14
US20140255615A1
Performing operations; transporting

Apparatus for depositing a thin layer of polymer resist on a substrate

#10 | 2014-08-07 ✅ Patent 9,643,342 granted on 2017-05-09
US20140220171A1
Performing operations; transporting

Apparati for fabricating thin semiconductor bodies from molten material

#11 | 2014-04-24 ✅ Patent 9,419,167 granted on 2016-08-16
US20140113156A1
Electricity

Making semiconductor bodies from molten material using a free-standing interposer sheet

#12 | 2013-02-14 ✅ Patent 8,696,810 granted on 2014-04-15
US20130036967A1
Performing operations; transporting

Selected methods for efficiently making thin semiconductor bodies from molten material for solar cells and the like

#13 | 2012-05-17 ✅ Patent 8,669,187 granted on 2014-03-11
US20120122266A1
Electricity

Porous lift-off layer for selective removal of deposited films

#14 | 2011-06-23 ✅ Patent 8,628,992 granted on 2014-01-14
US20110146782A1
Electricity

Methods to pattern diffusion layers in solar cells and solar cells made by such methods

#15 | 2011-06-02 ✅ Patent 8,633,052 granted on 2014-01-21
US20110129956A1
Electricity

Wedge imprint patterning of irregular surface

Also check out 1366 Technologies, Inc.'s (Bedford, United States) applicant profile with 9 patent applications submitted.

AssigneeID:

73809 ⎘