Baldwin Park, California
United States
35
2014-08-21
29
2014-12-23
These are the the leading inventors for applications assigned to TOUCHDOWN TECHNOLOGIES, INC.:
TOUCHDOWN TECHNOLOGIES, INC. based in Baldwin Park, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Fine pitch microelectronic contact array and method of making same
#2 | 2012-03-22 ✅ Patent 8,268,156 granted on 2012-09-18Multi material secondary metallization scheme in MEMS fabrication
#3 | 2011-10-13 ✅ Patent 8,278,956 granted on 2012-10-02Probecard system and method
#4 | 2010-12-09PROBE CARD SUBSTRATE WITH BONDED VIA
#5 | 2010-09-23 ✅ Patent 8,232,818 granted on 2012-07-31Probe head for a microelectronic contactor assembly, the probe head having SMT electronic components thereon
#6 | 2010-09-23 ✅ Patent 8,901,950 granted on 2014-12-02Probe head for a microelectronic contactor assembly, and methods of making same
#7 | 2010-09-23 ✅ Patent 8,305,101 granted on 2012-11-06Microelectronic contactor assembly, structures thereof, and methods of constructing same
#8 | 2009-09-24 ✅ Patent 7,692,436 granted on 2010-04-06Probe card substrate with bonded via
#9 | 2009-06-11 ✅ Patent 7,791,361 granted on 2010-09-07Planarizing probe card
#10 | 2009-03-19Multi-Pivot Probe Card For Testing Semiconductor Devices
#11 | 2009-03-19 ✅ Patent 7,589,547 granted on 2009-09-15Forked probe for testing semiconductor devices
#12 | 2009-01-22 ✅ Patent 7,761,966 granted on 2010-07-27Method for repairing a microelectromechanical system
#13 | 2008-12-04 ✅ Patent 7,759,951 granted on 2010-07-20Semiconductor testing device with elastomer interposer
#14 | 2008-10-16 ✅ Patent 7,772,859 granted on 2010-08-10Probe for testing semiconductor devices with features that increase stress tolerance
#15 | 2008-10-16 ✅ Patent 7,589,542 granted on 2009-09-15Hybrid probe for testing semiconductor devices
#16 | 2008-09-18SYSTEM TO OPTIMIZE A SEMICONDUCTOR PROBE CARD
#17 | 2008-09-04 ✅ Patent 7,728,612 granted on 2010-06-01Probe card assembly and method of forming same
#18 | 2008-05-08 ✅ Patent 7,724,010 granted on 2010-05-25Torsion spring probe contactor design
#19 | 2008-01-17 ✅ Patent 7,538,567 granted on 2009-05-26Probe card with balanced lateral force
#20 | 2008-01-10 ✅ Patent 7,759,952 granted on 2010-07-20Method of forming probe card assembly
#21 | 2007-12-06 ✅ Patent 7,378,734 granted on 2008-05-27Stacked contact bump
#22 | 2007-10-18 ✅ Patent 7,922,888 granted on 2011-04-12Post and tip design for a probe contact
#23 | 2007-09-06 ✅ Patent 7,365,551 granted on 2008-04-29Excess overdrive detector for probe cards
#24 | 2007-08-30STACKED CONTACT BUMP
#25 | 2007-08-09 ✅ Patent 8,232,816 granted on 2012-07-31Probe head with machine mounting pads and method of forming same
#26 | 2007-06-28 ✅ Patent 7,365,553 granted on 2008-04-29Probe card assembly
#27 | 2007-04-05Lateral interposer contact design and probe card assembly
#28 | 2007-03-22 ✅ Patent 7,355,422 granted on 2008-04-08Optically enhanced probe alignment
#29 | 2007-03-15Lateral interposer contact design and probe card assembly
#30 | 2007-02-20 ✅ Patent 7,180,316 granted on 2007-02-20Probe head with machined mounting pads and method of forming same
#31 | 2007-02-01 ✅ Patent 7,362,119 granted on 2008-04-22Torsion spring probe contactor design
#32 | 2007-02-01 ✅ Patent 7,245,135 granted on 2007-07-17Post and tip design for a probe contact
#33 | 2006-06-22 ✅ Patent 7,271,022 granted on 2007-09-18Process for forming microstructures
#34 | 2006-06-22 ✅ Patent 7,264,984 granted on 2007-09-04Process for forming MEMS
#35 | 2005-11-29 ✅ Patent 6,970,616 granted on 2005-11-29Optical cross-connect assembly
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