Assignee profile:

Sputtering Components, Inc.

City:

Owatonna, Minnesota

Country:

United States

Published Applications:

13

Last publication date:

2025-02-13

Patent Grants:

8

Last grant date:

2020-07-28

Top Inventors for applications by Sputtering Components, Inc.

These are the the leading inventors for applications assigned to Sputtering Components, Inc.:

Recent patent applications by Sputtering Components, Inc.

Sputtering Components, Inc. based in Owatonna, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2025-02-13
US20250054728A1
Electricity

RF SPUTTERING OF MULTIPLE ELECTRODES WITH OPTIMIZED PLAMSA COUPLING THROUGH THE IMPLEMENTATION OF CAPACITIVE AND INDUCTIVE COMPONENTS

#2 | 2019-02-21 ✅ Patent 10,727,034 granted on 2020-07-28
US20190057848A1
Electricity

Magnetic force release for sputtering sources with magnetic target materials

#3 | 2015-04-30
US20150120001A1
Physics

DECENTRALIZED PROCESS CONTROLLER

#4 | 2014-09-04 ✅ Patent 9,312,108 granted on 2016-04-12
US20140246312A1
Electricity

Sputtering apparatus

#5 | 2014-09-04 ✅ Patent 9,418,823 granted on 2016-08-16
US20140246310A1
Chemistry; metallurgy

Sputtering apparatus

#6 | 2014-07-03 ✅ Patent 9,362,093 granted on 2016-06-07
US20140184073A1
Electricity

Plasma enhanced chemical vapor deposition (PECVD) source

#7 | 2014-03-06 ✅ Patent 9,758,862 granted on 2017-09-12
US20140061029A1
Chemistry; metallurgy

Sputtering apparatus

#8 | 2014-01-09 ✅ Patent 9,198,274 granted on 2015-11-24
US20140007813A1
Electricity

Ion control for a plasma source

#9 | 2013-02-07
US20130032476A1
Chemistry; metallurgy

ROTARY CATHODES FOR MAGNETRON SPUTTERING SYSTEM

#10 | 2012-07-12 ✅ Patent 8,900,428 granted on 2014-12-02
US20120175251A1
Chemistry; metallurgy

Sputtering apparatus

#11 | 2011-06-30
US20110155568A1
Electricity

INDEXING MAGNET ASSEMBLY FOR ROTARY SPUTTERING CATHODE

#12 | 2011-02-03
US20110024987A1
Mechanical engineering

MECHANICAL SEAL ASSEMBLY FOR A ROTATABLE SHAFT

#13 | 2010-09-30 ✅ Patent 8,182,662 granted on 2012-05-22
US20100243428A1
Chemistry; metallurgy

Rotary cathode for magnetron sputtering apparatus

Also check out Sputtering Components, Inc.'s (Owatonna, United States) applicant profile with 7 patent applications submitted.

AssigneeID:

7877 ⎘