Owatonna, Minnesota
United States
13
2025-02-13
8
2020-07-28
These are the the leading inventors for applications assigned to Sputtering Components, Inc.:
Sputtering Components, Inc. based in Owatonna, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
RF SPUTTERING OF MULTIPLE ELECTRODES WITH OPTIMIZED PLAMSA COUPLING THROUGH THE IMPLEMENTATION OF CAPACITIVE AND INDUCTIVE COMPONENTS
#2 | 2019-02-21 ✅ Patent 10,727,034 granted on 2020-07-28Magnetic force release for sputtering sources with magnetic target materials
#3 | 2015-04-30DECENTRALIZED PROCESS CONTROLLER
#4 | 2014-09-04 ✅ Patent 9,312,108 granted on 2016-04-12Sputtering apparatus
#5 | 2014-09-04 ✅ Patent 9,418,823 granted on 2016-08-16Sputtering apparatus
#6 | 2014-07-03 ✅ Patent 9,362,093 granted on 2016-06-07Plasma enhanced chemical vapor deposition (PECVD) source
#7 | 2014-03-06 ✅ Patent 9,758,862 granted on 2017-09-12Sputtering apparatus
#8 | 2014-01-09 ✅ Patent 9,198,274 granted on 2015-11-24Ion control for a plasma source
#9 | 2013-02-07ROTARY CATHODES FOR MAGNETRON SPUTTERING SYSTEM
#10 | 2012-07-12 ✅ Patent 8,900,428 granted on 2014-12-02Sputtering apparatus
#11 | 2011-06-30INDEXING MAGNET ASSEMBLY FOR ROTARY SPUTTERING CATHODE
#12 | 2011-02-03MECHANICAL SEAL ASSEMBLY FOR A ROTATABLE SHAFT
#13 | 2010-09-30 ✅ Patent 8,182,662 granted on 2012-05-22Rotary cathode for magnetron sputtering apparatus
Also check out Sputtering Components, Inc.'s (Owatonna, United States) applicant profile with 7 patent applications submitted.
7877 ⎘