ADVANCE SEMICONDUCTOR ENGINEERING, INC.

City:

Kaohsiung

Country:

Taiwan

Published Applications:

Last publication date:

2020-01-23

Patent Grants:

Last grant date:

2020-05-26

Top Inventors for applications by ADVANCE SEMICONDUCTOR ENGINEERING, INC.

These are the the leading inventors for applications assigned to ADVANCE SEMICONDUCTOR ENGINEERING, INC.:

Chien-Hua Chen 2 Kaohsiung, Taiwan
Hsueh-An Yang 1 Kaohsiung, Taiwan
Pei-Chun Chen 1 Kaohsiung, Taiwan
Chih-Ming Chung 1 Kaohsiung, Taiwan

Teck-Chong Lee 1 Kaohsiung, Taiwan
Chih-Cheng LEE 1 Kaohsiung, Taiwan
Yung-Feng Gai 1 Kaohsiung, Taiwan
Cheng-Lin HO 1 Kaohsiung, Taiwan

Recent patent applications by ADVANCE SEMICONDUCTOR ENGINEERING, INC.

ADVANCE SEMICONDUCTOR ENGINEERING, INC. based in Kaohsiung, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2020-01-23 ✅ Patent 10,665,523 granted on 2020-05-26

US20200027810A1

Electricity

Semiconductor substrate, semiconductor package, and method for forming the same

#2 | 2013-02-07

US20130032889A1

Electricity

Silicon Chip Having Through Via and Method for Making the Same

#3 | 2011-06-30 ✅ Patent 8,415,790 granted on 2013-04-09

US20110156246A1

Electricity

Semiconductor package having passive device and method for making the same

#4 | 2006-04-20 ✅ Patent 7,351,612 granted on 2008-04-01

US20060084203A1

Electricity

Method for fabricating quad flat non-leaded package

#5 | 2005-07-26 ✅ Patent 6,921,968 granted on 2005-07-26

US10834936

Stacked flip chip package

AssigneeID:

7954 ⎘