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Assignee profile:

EBARA CORPORATION

City:

Toyko

Country:

Japan

Published Applications:

Last publication date:

2022-11-24

Patent Grants:

Last grant date:

2025-05-13

Top Inventors for applications by EBARA CORPORATION

These are the the leading inventors for applications assigned to EBARA CORPORATION:

Hiromasa MIYATA 2 Tokyo, Japan
Tomoatsu ISHIBASHI 2 Tokyo, Japan
Motoshi KOHAKU 2 Tokyo, Japan
Tetsuji TOGAWA 2 Tokyo, Japan

Nobutaka BANNAI 2 Tokyo, Japan
Yukihiro Fukusumi 2 Tokyo, Japan
Hideharu AOYAMA 1 Tokyo, Japan
Atsushi YOSHIDA 1 Tokyo, Japan

Naoya HANAFUSA 1 Tokyo, Japan
Atsuo Katagiri 1 Tokyo, Japan
Takahiro Nanjo 1 Tokyo, Japan
Fong-Jie DU 1 Tokyo, Japan

Makoto KASHIWAGI 1 Tokyo, Japan
Itsuki KOBATA 1 Tokyo, Japan
Takashi Koba 1 Tokyo, Japan
Hideo ARAI 1 Tokyo, Japan

Keiichi ISHIKAWA 1 Tokyo, Japan
Ken TAOKA 1 Tokyo, Japan
Asagi Matsugu 1 Tokyo, Japan
Toyoji Shinohara 1 Tokyo, Japan

Takashi KYOTANI 1 Tokyo, Japan
Kohtaro Kawamura 1 Tokyo, Japan
Kenichi AKAZAWA 1 Tokyo, Japan
Kazutomo Miyazaki 1 Tokyo, Japan

Akihiro Yazawa 1 Tokyo, Japan
Toshiharu Nakazawa 1 Tokyo, Japan
Yasuhiko SUZUKI 1 Tokyo, Japan
Seiji KASHIWAGI 1 Tokyo, Japan

Tetsuro SUGIURA 1 Tokyo, Japan
Takashi MITSUYA 1 Tokyo, Japan
Kenichi Kobayashi 1 Tokyo, Japan
Yu Ishii 1 Tokyo, Japan

Recent patent applications by EBARA CORPORATION

EBARA CORPORATION based in Toyko, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2022-11-24 ✅ Patent 12,300,520 granted on 2025-05-13

US20220375771A1

Electricity

Subfab area installation apparatus

#2 | 2022-11-17

US20220364770A1

Mechanical engineering

MULTI-REFRIGERATION-CYCLE APPARATUS

#3 | 2022-01-06 ✅ Patent 12,237,194 granted on 2025-02-25

US20220005716A1

Electricity

Substrate transporter and substrate processing apparatus including substrate transporter

#4 | 2021-06-10 ✅ Patent 11,618,123 granted on 2023-04-04

US20210170541A1

Performing operations; transporting

Polishing method and polishing apparatus

#5 | 2020-09-17 ✅ Patent 11,069,563 granted on 2021-07-20

US20200294847A1

Electricity

Method for processing substrate and substrate processing apparatus

#6 | 2014-12-04 ✅ Patent 9,956,524 granted on 2018-05-01

US20140352820A1

Performing operations; transporting

Vacuum pump with abatement function

#7 | 2014-12-04 ✅ Patent 9,630,296 granted on 2017-04-25

US20140352608A1

Performing operations; transporting

Substrate processing apparatus

#8 | 2014-11-13 ✅ Patent 9,824,903 granted on 2017-11-21

US20140331440A1

Electricity

Substrate cleaning apparatus

Also check out EBARA CORPORATION's (Toyko, Japan) applicant profile with 4 patent applications submitted.

AssigneeID:

82136 ⎘