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Assignee profile:

K.C. TECH CO., LTD.

City:

Anseong-si

Country:

South Korea

Published Applications:

18

Last publication date:

2018-10-04

Patent Grants:

14

Last grant date:

2019-10-01

Top Inventors for applications by K.C. TECH CO., LTD.

These are the the leading inventors for applications assigned to K.C. TECH CO., LTD.:

Recent patent applications by K.C. TECH CO., LTD.

K.C. TECH CO., LTD. based in Anseong-si, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2018-10-04 ✅ Patent 10,428,242 granted on 2019-10-01
US20180282581A1
Chemistry; metallurgy

Slurry composition for chemical mechanical polishing

 #2 | 2017-07-20 ✅ Patent 9,991,127 granted on 2018-06-05
US20170207100A1
Electricity

Method of fabricating integrated circuit device by using slurry composition

 #3 | 2017-06-29
US20170183537A1
Chemistry; metallurgy

POLISHING SLURRY COMPOSITION

 #4 | 2017-06-15 ✅ Patent 10,138,395 granted on 2018-11-27
US20170166780A1
Chemistry; metallurgy

Abrasive particle-dispersion layer composite and polishing slurry composition including the same

 #5 | 2017-02-23 ✅ Patent 10,428,240 granted on 2019-10-01
US20170051180A1
Chemistry; metallurgy

Method for preparing slurry composition and slurry composition prepared thereby

 #6 | 2017-02-02 ✅ Patent 10,435,587 granted on 2019-10-08
US20170029664A1
Chemistry; metallurgy

Polishing compositions and methods of manufacturing semiconductor devices using the same

 #7 | 2017-01-26 ✅ Patent 10,077,381 granted on 2018-09-18
US20170022391A1
Chemistry; metallurgy

Polishing slurry composition

 #8 | 2017-01-12 ✅ Patent 9,994,735 granted on 2018-06-12
US20170009353A1
Chemistry; metallurgy

Slurry composition for polishing tungsten

 #9 | 2014-12-18 ✅ Patent 9,704,729 granted on 2017-07-11
US20140366913A1
Performing operations; transporting

Substrate cleaning apparatus and method and brush assembly used therein

 #10 | 2010-07-29 ✅ Patent 8,968,476 granted on 2015-03-03
US20100186669A1
Electricity

Atomic layer deposition apparatus

 #11 | 2009-05-28 ✅ Patent 8,361,177 granted on 2013-01-29
US20090133336A1
Performing operations; transporting

Polishing slurry, method of producing same, and method of polishing substrate

 #12 | 2009-04-23
US20090100765A1
Performing operations; transporting

POLISHING SLURRY, METHOD OF PRODUCING SAME, AND METHOD OF POLISHING SUBSTRATE

 #13 | 2009-02-12 ✅ Patent 7,762,869 granted on 2010-07-27
US20090039178A1
Performing operations; transporting

Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface

 #14 | 2006-07-20
US20060156635A1
Chemistry; metallurgy

Abrasive particles, polishing slurry, and producing method thereof

 #15 | 2006-02-16
US20060032149A1
Performing operations; transporting

Polishing slurry, method of producing same, and method of polishing substrate

 #16 | 2005-12-01 ✅ Patent 7,442,112 granted on 2008-10-28
US20050266777A1
Performing operations; transporting

Nozzle for spraying sublimable solid particles entrained in gas for cleaning surface

 #17 | 2005-11-17 ✅ Patent 7,364,600 granted on 2008-04-29
US20050252092A1
Chemistry; metallurgy

Slurry for CMP and method of polishing substrate using same

 #18 | 2005-09-15 ✅ Patent 7,470,295 granted on 2008-12-30
US20050198912A1
Performing operations; transporting

Polishing slurry, method of producing same, and method of polishing substrate

Also check out K.C. TECH CO., LTD.'s (Anseong-si, South Korea) applicant profile with 4 patent applications submitted.

AssigneeID:

84706 ⎘