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Assignee profile:

Semigear Inc

City:

Wakefield, Massachusetts

Country:

United States

Published Applications:

19

Last publication date:

2021-02-04

Patent Grants:

17

Last grant date:

2022-09-27

Top Inventors for applications by Semigear Inc

These are the the leading inventors for applications assigned to Semigear Inc:

Jian Zhang 15 Brookline, MA United States
Shijian Luo 5 South Hamilton, MA United States
Joshua PINNOLIS 5 Newton, MA United States
Chunghsin Lee 4 Lynnfield, MA United States

Darren M. Simonelli 1 Seabrook, NH United States
Keith D. Mullins 1 Plaistow, NH United States
Jihoon KIM 1 Pyeongtaek-si, South Korea
Jonghoon KIM 1 Pyeongtaek-si, South Korea

David A. Wassen 1 Andover, MA United States
Suncheol LEE 1 Seoul, South Korea
Seockhwi LEE 1 Hwaseong-si, South Korea
Donghee LEE 1 Bucheon-si, South Korea

Jaeho PARK 1 Seoul, South Korea
Yonghoe HEO 1 Pyeongtaek-si, South Korea
Wonchang CHOI 1 Namyangju-si, South Korea

Recent patent applications by Semigear Inc

Semigear Inc based in Wakefield, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2021-02-04 ✅ Patent 11,456,192 granted on 2022-09-27

US20210035828A1

Apparatus and method for cooling substrate

#2 | 2019-12-12 ✅ Patent 10,790,179 granted on 2020-09-29

US20190378738A1

Alignment apparatus

#3 | 2019-11-14 ✅ Patent 11,315,807 granted on 2022-04-26

US20190348308A1

Substrate pressing module, substrate pressing method, substrate treating apparatus including the substrate treating module, and the substrate treating method

#4 | 2019-10-31 ✅ Patent 10,861,735 granted on 2020-12-08

US20190333800A1

Substrate support unit

#5 | 2019-07-25 ✅ Patent 10,937,757 granted on 2021-03-02

US20190229086A1

Device packaging facility and method, and device processing apparatus utilizing DEHT

#6 | 2018-02-01 ✅ Patent 10,283,481 granted on 2019-05-07

US20180033766A1

Device packaging facility and method, and device processing apparatus utilizing DEHT

#7 | 2016-11-17 ✅ Patent 9,741,683 granted on 2017-08-22

US20160336294A1

Device packaging facility and method, and device processing apparatus utilizing phthalate

#8 | 2016-11-17 ✅ Patent 9,824,998 granted on 2017-11-21

US20160336293A1

Device packaging facility and method, and device processing apparatus utilizing DEHT

#9 | 2016-08-11 ✅ Patent 9,472,531 granted on 2016-10-18

US20160233191A1

Device packaging facility and method, and device processing apparatus utilizing phthalate

#10 | 2016-05-19 ✅ Patent 9,629,258 granted on 2017-04-18

US20160143156A1

Reflow treating unit and substrate treating apparatus

#11 | 2016-05-19 ✅ Patent 9,572,266 granted on 2017-02-14

US20160143155A1

Reflow treating unit and substrate treating apparatus

#12 | 2015-02-05

US20150034702A1

Apparatus & method for treating substrate

#13 | 2015-02-05 ✅ Patent 9,226,407 granted on 2015-12-29

US20150034700A1

Reflow treating unit and substrate treating apparatus

#14 | 2015-02-05

US20150034699A1

Reflow treating unit & substrate treating apparatus

#15 | 2012-11-15 ✅ Patent 8,524,593 granted on 2013-09-03

US20120289042A1

Arrangement for solder bump formation on wafers

#16 | 2011-09-08 ✅ Patent 8,274,161 granted on 2012-09-25

US20110215483A1

Flux-free chip to substrate joint serial linear thermal processor arrangement

#17 | 2011-08-18 ✅ Patent 8,252,678 granted on 2012-08-28

US20110198388A1

Performing operations; transporting

Flux-free chip to wafer joint serial thermal processor arrangement

#18 | 2008-01-10 ✅ Patent 7,632,750 granted on 2009-12-15

US20080009122A1

Arrangement for solder bump formation on wafers

#19 | 2006-03-07 ✅ Patent 7,008,879 granted on 2006-03-07

US10832782

Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry

Also check out SEMIgear, Inc.'s (Wakefield, United States) applicant profile with 9 patent applications submitted.

AssigneeID:

87230 ⎘