Osaka
Japan
5
2015-02-05
5
2015-11-10
These are the the leading inventors for applications assigned to NOMURA PLATING CO., LTD.:
NOMURA PLATING CO., LTD. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Conductive hard carbon film and method for forming the same
#2 | 2010-03-18 ✅ Patent 8,470,155 granted on 2013-06-25Copper/niobium composite piping material produced by copper electroforming, process for producing the same and superconducting acceleration cavity produced from the composite piping material
#3 | 2009-06-25 ✅ Patent 7,909,232 granted on 2011-03-22Mold and method of manufacturing the same
#4 | 2008-06-26 ✅ Patent 7,896,061 granted on 2011-03-01Product having improved zinc erosion resistance
#5 | 2005-12-22 ✅ Patent 8,517,795 granted on 2013-08-27Surface treatment method for vacuum member
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