SAKAE CO., LTD.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2016-12-22

Patent Grants:

Last grant date:

2013-08-27

Top Inventors for applications by SAKAE CO., LTD.

These are the the leading inventors for applications assigned to SAKAE CO., LTD.:

Koichi MATSUMOTO 5 Fujioka-shi, Japan
Yukihiro TAKEDA 4 Kodama-gun, Japan
Yoshio MASUKO 3 Kodama-gun, Japan
Masamichi MORIYA 1 Fujioka-shi, Japan

Yasuyuki MITOMO 1 Fujioka-shi, Japan
Shigeo ASAMI 1 Fujioka-shi, Japan
Takafumi OKAWARA 1 Fujioka-shi, Japan
Nobuo Fujishima 1 Yamato, Japan

Nobuo FUJISHIMA 1 Yamato-shi, Japan
Yoshio MASUKO 1 Fujioka-shi, Japan
Yasumasa OGINO 1 Fujioka-shi, Japan
Yasuyuki Mitomo 1 Fujioka, Japan

Yuichi SHITARA 1 Fujioka-shi, Japan
Kenta TAKAHASHI 1 Fujioka-shi, Japan
Yoshio Masuko 1 Fujioka, Japan

Recent patent applications by SAKAE CO., LTD.

SAKAE CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2016-12-22

US20160367998A1

Performing operations; transporting

SHREDDING MECHANISM, SHREDDER USING THE SAME, AND METHOD OF MANUFACTURING A SHREDDING MECHANISM

#2 | 2016-01-21

US20160018426A1

Physics

AUTOMATIC ANALYSIS DEVICE

#3 | 2015-11-12

US20150321198A1

Performing operations; transporting

SHREDDING UNIT, SHREDDER USING THE SAME, AND SHEET-LIKE-OBJECT PROCESSING APPARATUS

#4 | 2015-10-22

US20150298134A1

Performing operations; transporting

TRASH RECEIVING STRUCTURE FOR SHREDDER AND SHREDDER USING THE SAME

#5 | 2015-04-30

US20150115077A1

Performing operations; transporting

SHREDDER AND SHEET-LIKE-OBJECT PROCESSING APPARATUS USING THE SAME

#6 | 2012-03-01 ✅ Patent 8,517,080 granted on 2013-08-27

US20120048470A1

Performing operations; transporting

Laminating device and thermal pressure bonding and conveying device used in laminating device

AssigneeID:

91523 ⎘