Tokyo
Japan
5
2019-07-11
4
2021-05-18
These are the the leading inventors for applications assigned to HELLERMANNTYTON CO., LTD.:
HELLERMANNTYTON CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Manual bundling tool
#2 | 2019-05-02 ✅ Patent 11,008,123 granted on 2021-05-18Manual binding tool
#3 | 2016-08-11 ✅ Patent 10,400,917 granted on 2019-09-03Cable tie locking structure and cable tie tool
#4 | 2015-06-04 ✅ Patent 10,232,964 granted on 2019-03-19Manual bundling tool
#5 | 2007-11-29Part mounting clamp
Also check out HellermannTyton CO., LTD.'s (Tokyo, Japan) applicant profile with 3 patent applications submitted.
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