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Assignee profile:

EagleBurgmann Japan Co., Ltd.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-06-06

Patent Grants:

Last grant date:

2025-10-14

Top Inventors for applications by EagleBurgmann Japan Co., Ltd.

These are the the leading inventors for applications assigned to EagleBurgmann Japan Co., Ltd.:

Hidekazu TAKAHASHI 4 Tokyo, Japan
Hiroyuki Ochiai 2 Tokyo, Japan
Hiroyuki Ochiai 2 Minato-ku, Japan
Hidekazu Takahashi 2 Minato-ku, Japan

Masahiko Inoue 2 Minato-ku, Japan
Masahiko Inoue 2 Tokyo, Japan
Kazuhiko SATO 1 Minato-ku, Tokyo, Japan
Hiroyuki ISHIHARA 1 Tokyo, Japan

Ryo NAKAMURA 1 Tokyo, Japan
Takashi Yanagisawa 1 Tokyo, Japan
Masakazu KITO 1 Minato-ku, Tokyo, Japan
Takanori Sato 1 Tokyo, Japan

Hideki MARUYAMA 1 Minato-ku, Tokyo, Japan
Masakazu KITO 1 Tokyo, Japan
Hiroyuki ISHIHARA 1 Minato-ku, Tokyo, Japan
Hideki MARUYAMA 1 Tokyo, Japan

Kazuhiko Sato 1 Tokyo, Japan

Recent patent applications by EagleBurgmann Japan Co., Ltd.

EagleBurgmann Japan Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-06-06 ✅ Patent 12,442,450 granted on 2025-10-14

US20240183449A1

Mechanical engineering

SHAFT SEALING DEVICE

#2 | 2020-06-25 ✅ Patent 11,300,210 granted on 2022-04-12

US20200200276A1

Mechanical engineering

Mechanical seal

#3 | 2017-05-04 ✅ Patent 10,393,166 granted on 2019-08-27

US20170122358A1

Mechanical engineering

Set screw, fixing structure, fixing method and sealing structure

#4 | 2017-02-23 ✅ Patent 10,024,437 granted on 2018-07-17

US20170051833A1

Mechanical engineering

Assembly method of magnetic fluid seal and magnetic fluid seal

#5 | 2015-12-24

US20150369368A1

Mechanical engineering

SEALING DEVICE

#6 | 2015-11-05 ✅ Patent 9,383,019 granted on 2016-07-05

US20150316153A1

Mechanical engineering

Mechanical seal

#7 | 2015-07-02 ✅ Patent 9,644,746 granted on 2017-05-09

US20150184753A1

Mechanical engineering

Mechanical seal

#8 | 2014-03-27 ✅ Patent 9,147,571 granted on 2015-09-29

US20140082906A1

Electricity

Welded bellows for semiconductor manufacturing device

#9 | 2014-02-06 ✅ Patent 8,727,355 granted on 2014-05-20

US20140035236A1

Mechanical engineering

Semiconductor fabrication device welded bellows

Also check out EagleBurgmann Japan Co., Ltd.'s (Tokyo, Japan) applicant profile with 12 patent applications submitted.

AssigneeID:

95058 ⎘